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系統識別號 U0026-3108201609214600
論文名稱(中文) 應用陰影疊紋法量測電子元件的翹曲量及系統升溫校正
論文名稱(英文) Measurement of Warpage of Electronic Components and System Calibration under Heating Condition Using Shadow Moire Method
校院名稱 成功大學
系所名稱(中) 機械工程學系
系所名稱(英) Department of Mechanical Engineering
學年度 104
學期 2
出版年 105
研究生(中文) 劉諭勳
研究生(英文) YU-SYUN LIOU
學號 n16021391
學位類別 碩士
語文別 中文
論文頁數 106頁
口試委員 指導教授-陳元方
口試委員-王偉中
口試委員-林世聰
口試委員-潘文峰
中文關鍵字 陰影疊紋法  翹曲量  雙立方樣條內插 
英文關鍵字 Shadow Moiré  Warpage  Bicubic Spline Interpolation 
學科別分類
中文摘要 陰影疊紋系統現今最常應用於量測電子元件的翹曲量,在高溫量測時由於系統會因為加熱膨脹產生不可預期的變動,最後造成量測上的誤差。
本文主要目的是應用陰影疊紋法系統,在高溫狀態下檢測電子元件翹曲量變化。首先依據JEDEC標準提出以最小平方法(Least Mean Squares)法初步將晶片旋轉至水平,運用組合法將高於底座平面的點再進行組合判別,最後可得最高底座平面。且以模擬馬鞍形與半圓柱形貌方式驗證搜尋法的正確性。另外以同組電子晶片將實驗所得翹曲量數據與華東科技量測數據比較差異。
在升溫量測時,利用校正片在不同溫度時,所量測到的量測值與已知值之間的誤差,當作校正值。本文使用雙立方樣條內插,將校正片上選取二十五個校正值內插出方形校正值區域。經過校正片升溫量測的結果,絕對平均誤差最大為1.51um,由此可知此方法可提高量測準確度。
英文摘要 Shadow moiré method is commonly used to measure warpage of electronic components. When measuring specimen by shadow moiré system under heating condition, the system will produce unpredictable changes due to thermal expansion and lead to measurement error.
In this paper, the major purpose is to measure the warpage of electronic components by using shadow moiré method under high temperature condition. According to JEDEC STANDARD, we use least mean squares to rotate the chip to be horizontal at first. Next, we discriminate the point above seating plane by combined method,so that we can get the highest seating plane. Then, we simulate the profiles of saddle and half cylinder to examine the correctness. And we will compare our measuring result to the warpage that measured by Walton Engineering Inc.
We can get error between measured value and standard value that measured by calibration plate in different temperature. The error is called calibration value. In this paper, we use bicubic spline interpolation to interpolate twenty-five calibration value of twenty-five points that we choose on calibration plate. After that, we can get a rectangular calibration area. According to the testing result, the maximum Absolute average error is 1.51um. It shows that shadow moire system calibration program under heating condition can make accuracy of measurement much higher.
論文目次 目錄
摘要... I
SUMMARY ...II
致謝 ...VIII
符號說明... XX
第一章緒論... 1
1. 1研究背景及目的... 1
1. 2文獻回顧... 2
1. 3本文架構... 4
第二章陰影疊紋法原理... 5
2. 1陰影疊紋法基本原理[21] ...5
2. 2相位移法[23]... 9
2. 3 MACY相位展開法[22]... 13
第三章共面性量測原理... 14
3. 1JEDEC STANDARD共面性定義... 14
3. 1. 1 最小平方法(Least Mean Squares)... 16
3. 1. 2 JEDEC底座平面(JEDEC Seating Plane).... 17
3. 2最小平方法搭配組合法搜尋原理... 19
3. 2 .1組合法... 20
3.3 共面性模擬與測試... 21
3.4模擬試件與結果... 22
第四章實驗裝置與量測步驟... 28
4. 1陰影疊紋系統之介紹... 28
4. 2溫控系統 ...30
4. 3實驗步驟 ...31
4. 4系統測試... 33
4.4. 1校正片試件介紹... 33
4.4. 2陰影疊紋系統常溫校正 ...41
4.4. 3陰影疊紋系統校正片升溫校正... 50
第五章實驗量測與討論... 56
5.1搜尋法比較差異 ...56
5.2陰影疊紋系統晶片升溫量測... 58
第六章 結論與建議 ...64
6.1 結論 ...64
6.2 建議 ...65
附錄 ...66
A.雙立方樣條內插(BICUBIC SPLINE INTERPOLATION)...66
B.X方向高溫校正片量測平均值... 68
C.五次平均值與標準值的誤差... 70
D. 校正片校正前高度量測值... 72
E. 校正後高度值.. 74
F. 法一校正後與標準值誤差.. 76
G.法二校正後與標準值誤差... 78
H. 法三校正後與標準值... 80
I.晶片升溫高度與底座平面位置... 82
參考文獻... 103
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