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系統識別號 U0026-3108201110215700
論文名稱(中文) 背後曝光方法製造微針陣列模仁與應用
論文名稱(英文) A Study on the Fabrication of Micro-Needle Array Mold Using Backside Exposure Method and Its Application
校院名稱 成功大學
系所名稱(中) 機械工程學系專班
系所名稱(英) Department of Mechanical Engineering (on the job class)
學年度 99
學期 2
出版年 100
研究生(中文) 林居宏
研究生(英文) Chu-Hong Lin
學號 N1793108
學位類別 碩士
語文別 中文
論文頁數 157頁
口試委員 指導教授-鍾震桂
口試委員-于劍平
口試委員-吳博雄
中文關鍵字 微針陣列  皮膚吸收  LIGA-like技術 
英文關鍵字 micro-needle array  skin transdermal  LIGA-like technology 
學科別分類
中文摘要 微針陣列是皮膚穿刺的重要元件,它的微小針頭能夠有效地穿刺皮膚表皮層造成產生微小傷口,可供化粧品或藥物塗抹皮膚且快速被吸收產生效果。微針陣列的尺寸由數十微米的針頭所組成矩陣排列,其針頭尺寸微小可穿刺皮膚卻不會碰觸皮膚痛覺神經,極具潛力被應用於化粧品或藥物之皮下吸收。運用微針陣列微模仁進行塑膠材料塑化成型以製造便宜的塑膠材料微針陣列貼片,是一種較可行的量產方法。微模仁可利用超精密機械加工機之鑽石切削刀具直接在金屬表面進行機械加工而製成,然而此方法卻有鑽石切削刀具易損耗、機械加工時間較長、針形結構不易加工等缺點。LIGA-like技術被視為目前能夠取代超精密機械加工技術製作微模仁的方法,其乃利用微影製程製作具微針結構光阻,並利用電鑄技術翻製金屬模仁。本研究發展LIGA-like技術為基礎的背後曝光製造方法,進行微針陣列模仁製程研究,並以該模仁進行熱壓製作塑膠材料微針陣列。

關鍵字:微針陣列、皮膚吸收、LIGA-like技術
英文摘要 Micro-needle array is a crucial component and can penetrate into skin by its tiny needles with painless for effective skin transdermal of cosmetics and drugs. It is possible to manufacture micro-needle array in high-volμme production by plastic forming using a micro-mold. Using ultra-precision machining machine and applying diamond cutting tools to directly machine the surface of mold, micro-mold can be fabricated. However, this method have some disadvantages including diamond cutting tools are easy to wear and tear, machining time is longer, Needle structures can not be machined efficiently. Therefore, to study and develop an innovative fabrication method of micro-needle array mold is the motivation of this study.
LIGA-like technology is considered to replace the traditional technology to produce ultra-precision machining method of micro-mold. LIGA-like technology includes photo-lithography process to fabricate micro-needles of photoresists, electroforming process to fabricate micro-needles of metal molds, and forming process to fabricate micro-needle of plastic. The goal of this study is to use the LIGA-like technology as a core technology to develop and evaluate the backside exposure method to fabricate the micro-needle array using the micro-needle LIGA-like mold for skin transdermal of cosmetics and drugs.
Keywords: micro-needle array, skin transdermal, LIGA-like technology
論文目次 中文摘要 I
Abstract II
誌謝 III
目錄 IV
表目錄 VI
圖目錄 VII
第1章 緒論 2
1.1 簡介 2
1.2 研究動機與目的 3
1.3 論文架構 6
第2章 文獻回顧 8
2.1 微針結構陣列 8
2.2 LIGA-like製程技術 18
2.3 背後曝光技術之繞射光學效應 23
2.4 電鑄原理 27
2.5 微熱壓成型 33
第3章 實驗方法與步驟 43
3.1 實驗架構與流程 45
3.1.1 微影製程流程與步驟 46
3.1.2 電鑄製程流程與步驟 51
3.1.3 熱壓成型製程流程與步驟 52
3.2 實驗設備與量測儀器 55
3.2.1 實驗設備 55
3.2.2 量測儀器: 62
第4章 微影製程微針陣列實驗結果與討論 65
4.1 微影製程微針矩陣實驗結果 66
4.1.1 不同光罩孔徑下各種光罩間隙(光罩間隙)實驗結果 67
4.1.2 光罩孔徑遞增下不同光罩間隙下尺寸變化實驗結果 104
4.1.3 光罩間隙遞增下不同光罩孔徑尺寸變化結果 108
4.2 微影製程微針矩陣實驗討論 112
第5章 電鑄微模仁實驗結果與討論 128
5.1 電鑄微模仁實驗結果 128
5.2 電鑄微模仁實驗討論 130
第6章 熱壓成型實驗結果與討論 131
6.1 熱壓成型實驗結果 131
6.1.1 熱壓時間增加對微針成形影響性(A系列實驗) 133
6.1.2 熱壓壓力增加對微針成形影響性(B系列實驗) 137
6.1.3 膜材厚度變化對微針成形影響性(C系列實驗) 140
6.2 熱壓成型實驗討論 143
第7章 結論與未來展望 145
7.1 結論 145
7.2 本文貢獻 147
7.3 未來展望 147
參考文獻 148

參考文獻 1. M. Bin, G. Zhiyin, L. Sheng, “Flexible Silicon Microneedles Array for Micro Fluid Transfer,” 6th International Conference Electronic Packaging Technology, pp. 1-5 (2005).
2. Han J. G. E. Gardeniers, Regina Luttge, Erwin J. W. Berenschot, Meint J. de Boer Shuki Y. Yeshurun, Meir Hefetz, Ronny van’t Oever, and Albert van den Berg, “Silicon Micromachined Hollow Microneedles for Transdermal Liquid Transport” Journal of Microelectromechanical System, Vol. 12, pp. 855-862 (2003).
3. Liwei Lin, Albert P. Pisano, “Silicon-Processed Microneedles”, IEEE Journal of Microelectro mechanical System, Vol. 8, pp. 78-84 (1999).
4. P. Seung-Joon, B. Sangwon, L. Jung-Min, P. Yonghwa, L. Ahra , C. Seok, C. Junkeun, C. Kukjin, and C. Dongil Dan, “In-Plane Single-Crystal-Silicon Microneedles For Minimally Invasive Microfluid Systems,” Sensors and Actuators A 114, pp. 276–284, (2004).
5. Jung-Hwan Park, Mark G. Allen, and Mark R. Prausnitz, “Biodegradable Polymer Microneedles: Fabrication, Mechanics and Transdermal Drug Delivery” Journal of Controlled Realease, Vol.104, pp. 51-66, (2005).
6. Shyh-Chyi Kuo and Yukon Chou, “A Novel Polymer Microneedle and PDMS Micromolding Technique” Tamkang Jurnal of Science and Engineering, Vol. 7, pp 95-98 (2004).
7. Seung-Joon Paik, Sangwon Byun, Jung-Min Lim, Yonghwa Park, Ahra Lee, Seok Chung, Junkeun Chang, Kukjin Chun, Dongil “Don” Cho, “In-plane Single-crystal-silicon Microneedles for Minimally Invasive Microflud Systems” Sensors and Actuators Vol. 114, pp. 276-284 ,(2004).
8. 江明玲,當代基本護理學,華杏出版社,(2002).
9. 葉旭均,三維斜口電鑄微針陣列之研製,國立清華大學工程與系統科學系碩士論文,(2003).
10. 李慶鴻,中空金屬微針頭陣列與微電破晶片之研製,國立台灣海洋大學機械與機電工程學系碩士論文,(2006).
11. http://www.china.com.cn/chinese/TEC-c/135944.htm
12. S. Chandrasekaran, D. J. Brazzle and A. Bruno Frazier, “Surface Micromachined Metallic Microneedles,” JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 12, NO. 3, pp. 281-288,( 2003)
13. L. Liwei and P. A. Pisano, “Silicon-Processed Microneedles,” JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 8, NO. 1, pp. 78-84, (1999)
14. L. Ran, W. Xiaohao, Z. Zhaoying, and D. J. Williams, “Microneedles Array For Fluid Extraction And Drug Delivery,” Proceedings of 2003 International Symposiμm on Micromechatronics and Hμman Science, pp. 239 – 244,( 2003)
15. P. Jung-Hwan, G. M. Allen and R. M. Prausnitz1, “Biodegradable Polymer Microneedles: Fabrication, Mechanics And Transdermal Drug Delivery,” 26th Annual International Conference of the IEEE EMBS, pp. 2654 – 2657,( 2004).
16. M. Bin, G. Zhiyin, L. Sheng, “Flexible Silicon Microneedles Array for Micro Fluid Transfer,” 6th International Conference Electronic Packaging Technology, pp. 1-5,( 2005).
17. H. Heng-Chi, and F. Chien-Chung, “Out-Of-Plane Polymer Hollow Microneedle Array Integrated On A Microfluidic Chip,” Sensors, pp, 484 - 487, (2005).
18. K. Serope, Manufacturing Engineering and Technology, ADDISON- WESLEY PUBLISHING COMPANY
19. J.G.E. Gardenier, J.W. Berenschot, M.J. de Boer, Y. Yeshurun, M. Hefetz,R. van 't Oeve and A. van den Berg, “Silicon Micromachined Hollow Microneedles For Transdermal Liquid Transfer,” Micro Electro The Fifteenth IEEE International Conference of Mechanical Systems., pp. 141 – 144, (2002).
20. H. J. G. E. Gardeniers, L. Regina, J. W. E. Berenschot, M. J. de Boer, Y. S. Yeshurun, M. Hefetz, R. van’t Oever, and A. van den Berg, “Silicon Micromachined Hollow Microneedles For Transdermal Liquid Transport,” JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 12, NO. 6, pp. 855-862, (2003).
21. G. Patrick and S. Goran, “Novel, Side Opened Out-Of-Plane Microneedles For Microfluidic Transdermal Interfacing,” The Fifteenth IEEE International Conference of Micro Electro Mechanical Systems, pp. 467-470, (2002).
22. S. Boris, and L. Dorian, “Arrays of Hollow Out-of-Plane Microneedles for Drug Delivery,” JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 14, pp. 472 – 479, (2005).
23. P. Seung-Joon, L. Jung-Min, J. Ilwoo, P. Yonghwa, B. Sangwon, C. Seok, C. Kukjin, C. Junkeun and C. Dongil Dan, “A Novel Microneedle Array Integrated With A PDMS Biochip For Microfluid Systems,” 12th International Conference of Solid-State Sensors, Actuators and Microsystems, pp. 1446 – 1449,( 2003).
24. Nicolle Wilke, Michael L Reed, and Anthony Morrissey, “The Evolution From Convex Corner Undercut Towards Microneedle Formation: Theory and Experimental Verification”, Journal of Micro mechanics and Micro engineering, pp. 808-814, (2005).
25. Y.Cheng, C.Y.Lin, D.H. Wei, B.Loechel and G.Gruetzner,“Wall Profile of Thick Photoresist Generated via Contact Printing.” IEEE JOURNAL OF MICROELECTRO MECHANICAL SYSTEMS, Vol. 8 March (1999).
26. F.G.Tseng, C.S.Yu, “High aspect ratio ultrathick micro-stencil by JSR THB-430N negative UV photroresist.” Sensors and Actuators, A97-98 pp. 764-770, (2002).
27. Y.J.Chuang, F.G.Tseng, W.K.Lin, “Reduction of diffraction effect of UV exposure on SU-8 negative thick photoresist by air 光罩間隙 elimination.” Microsystem Technologies, pp. 308–313, 8 (2002).
28. C.G.K.Malek,“SU8 resist for low-cost X-ray patterning of high-resolution high-aspect-ratio MEMS” Microelectronics Journal pp. 101-105, 33 (2002).
29. K.Kim, D.S.Park, H.M.Lu, W.Che, K.Kim, J.B.Lee and C.H.Ahn, “A tapered hollow metallic microneedle array using backside exposure of SU-8.” J. Micromech. Microeng, pp. 597–603, 14 (2004).
30. S.Sugiyama, S.Khμmpuang and G.Kawaguchi, “Plain-pattern to cross-section transfer(PCT) technique for deep x-ray lithography and applications.” J. Micromech. Microeng pp. 1399–1404. , 14 (2004),
31. K.Y.Hung, H.T.Hu and F.G.Tseng, “Application of 3D glycerol-compensated inclined-exposure technology to an integrated optical pick-up head.” J.Micromech. Microeng,pp. 975–983, 14 (2004).
32. J.H.Park, M.G.Allen and M.R.Prausnitz, “Biodegradable polymer microneedles: Fabrication, mechanics andtransdermal drug delivery.” Journal of Controlled Release, pp. 51–66, 104 (2005).
33. R.Turner, Y.Desta, K.Kelly, J.Zhang, E.Geiger and D.C.Mancini, “Tapered LIGA HARMs.” J.Micromech.Microeng,pp. 367-372, 13 (2003).
34. R.F.Shyu, H.Yang, “Vacuμm suction aid for microlens array formation using LIGA-like process.” Int. J. Adv. Manuf. Technol. pp. 518–523, 29 (2006).
35. G.J.Wang, Y.F.Hsu, S.H.Hsu and R.H.Horng ,“JSR photolithography based microvessel scaffold fabrication and cell seeding.”, Biomed Microdevices,pp. 17–23, 8 (2006).
36. J.S.Kuo, K.T.Chiu, S.W.Hsu and P.H.Chen, “A novel technique for the fabrication of herringbone grooves in a dynamic thrust bearing combining UV-LIGA with electro-discharge machining”, Microsyst Technol,pp. pp. 529-536, 12 (2006).
37. V.S.Rao, V.Kripesh, S.W.Yoon and A.A.O.Tay, “A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist.” J. Micromech. Microeng,pp. 1841–1846, 16 (2006).
38. H.Huang, C.Fu, “Different fabrication methods of out-of-plane polymer hollow needle arrays and their variations.” J. Micromech. Microeng, pp. 393–402, 17 (2007).
39. W. Menz, W. Bacher, W. Bier, O.F. Hagena, J. Mohr and D. Seidel, “Combination of LIGA with other microstructure technologies,” Microsystem technology, 2, pp. 166, (1996).
40. E. Gogolids, P. Vauvert, A. Rhalllabi and G. Turban, “Complete Plasma Physics, Plasma chemistry, and Surface Chemistry Simulation of SiO2 and Si etching in CF4 Plasmas,” Microelectronic Engineering, 41-42, pp.391-394, (1998).
41. R.Williams,S.Richard and Muller, “Etch Rate for MicromachiningProcessing,” Journal of Microelectromechanical Systems, 5(4),pp. 256-269, (1996).
42. 魏茂國 ,準分子雷射應用於奈米加工技術簡介 ,Newsletter of The Chinese Society of Mechanism and Machine theory,pp. 1-6, August (1998).
43. L. Bernd, “Thick layer resists for surface micromachining,” Micromech Microeng, 10, pp. 108-115, (2000).
44. K D Vora, B Y Shew, E C Harvey, J P Hayes and A G Peele, Sidewall slopes of SU-8 HARMST using deep x-ray lithography, J. Micromech. Microeng. 18 (2008).
45. 洪益智,張維哲,鍾震桂;利用背後曝光和電鑄技術製作金屬與高分子的堆疊微結構;中國機械工程學會第二十一屆全國學術研討會論文集,中華民國九十三年十一月二十六日~二十七日。
46. H Huang, W Yang, T Wang, T Chuang and C Fu, 3D high aspect ratio micro structures fabricated by one step UV lithography, J. Micromech. Microeng, pp.291–296, 17 (2007).
47. Won-Jong Kang, Erik Rabe, Stefan Kopetz and Andreas Neyer, Novel exposure methods based on reflection and refraction effects in the field of SU-8 lithography, J. Micromech. Microeng,pp.821–831,16 (2006).
48. Yao Cheng, Ching-Yao Lin, Der-Hsin Wei, Bernd Loechel, and Gabi Gruetzner, Wall Profile of Thick Photoresist Generated via Contact Printing, IEEE Journal of Microelectromechanical Systems, Vol. 8, No. 1, 18-26, (1999).
49. 楊啟榮,強玲英,黃奇聲,微系統LIGA製程之精密電鑄技術,科儀新知,22(1),15(2000).
50. 張瑞宗,以厚膜光阻技術製備高縱橫比銅導柱之研究,交通大學材料科學研究所碩士論文, (1999).
51. 張瑞斌,微電鍍技術及其在生物晶片之應用,國立成功大學工程科學系碩士論文, (2001).
52. 蘇癸陽,實用電鍍理論與實際,復文書局,(2003).
53. M. Heckele, W. Bacher, K.D. Muller,”Hot embossing the molding echnique for plastic microstructures”, Microsyst- em Technology 4, pp. 122-124,(1998).
54. L. Weber, W. Ehrfeld, H. Freimuth, Manfred Lacher, Heinz Lehr and Bernhard Pech,”Micro molding-A powerful tool for the large scale production of precise microstructures” ,SPIE, pp. 156-167,(1996).
55. H. Becker, U. Heim,” Hot embossing as a method for the fabrication of Polymer high aspect ratio structures”, Sensors and Actuators, pp. 130-135,(2000).
56. H. Becker, U. Heim, ”Silicon as tool material for polymer hot embossing”.IEEE Con’ , pp. 228-229,(1999).
57. D. Harry, P. William, ”Polymer deformation and filling modes During microembossing”,J. Micromech. Microeng 14, pp.1625-1632,(2004).
58. L.J.Heyderman,C. Schift, J.David, T. Gobrecht, L.J. Schweizer ”Flow behavior of thin polymer films used for hot embossing lithography”, Microelectronic Engineering 54, pp. 229-245,(2000).
59. J. Narasimhan, I. Papautsky, ”Polymer embossing tools for rapid prototyping plastic microfluidic devices”, J. Microme-ch . Microeng, vol. 14, no. 1, pp. 96-103,(2004).
60. N.S. Ong , Y.H. Koh, Y.Q. Fu, ” Microlens array produced usinghot embossing process”, Microelectronic Engineering 60 , pp. 365-379 ,(2002).
61. Yi-Je Juang, L.James Lee , Kurt W.Koelling , ” Hot Embossing in Microfabrication.PartⅠ:experimental&PartⅡRheological Characterization and Process Analysis ”, Polymer Engineering and Science, pp.539-551,(2002).
62. Jin Tae Kim, Keun Byoung Yoon, Choon-Gi Choi, ” Passive Alignment Method of Polymer PLC Devices by Hot Embossing Technique ”, IEEE Photonics Technology Letters, vol.16, no.7, pp. 1664-1666,(2004).
63. 蕭兆豐,”微熱壓成型技術校正、量測與模流分析”,淡江大學機械與機電工程學系碩士論文,(2003)。
64. 林威宇,”動態壓力控制對微結構熱壓特性的影響暨加工過程中聚丙烯的結晶特性的初步探討”,交通大學機械工程研究所碩士論文(2003).
65. 張哲豪,”流體微熱壓製程開發研究”,台灣大學機械工程研究所博士論文(2004).
66. 黃重凱,”智慧型模仁的初步開發”,交通大學機械工程研究所碩士論文(2003).
67. 郭献彰,” 微結構熱壓成型之製程研究”,大葉大學機械工程研究所碩士論文(2005).
68. 董毓才,”超音波熱壓印微結構加工參數影響之研究”,長庚大學機械工程研究所碩士論文(2004).
69. 賴文童,”微結構熱壓成形缺陷之探討”,交通大學機械工程研究所碩士論文(2000).
70. 王培良,”塑膠微熱壓成形特性之研究”,交通大學機械工程研究所碩士論文(1997).
71. 羅金德,”超音波加熱壓印微結構之研究”,台灣大學機械工程研究所碩士論文(2002).
72. H.S.Lee,S.K.Lee, T.H. Kwon, S.S. Lee, ”Birefringence Distribution In V-grooved optical part by hot embossing process”, IEEE Con’, pp. 135-136 (2002).
73. H Huang and C Fu, “Different fabrication methods of out-of-plane polymer hollow needle arrays and their variations”, J. Micromech. Microeng, 17 , pp. 393–402, (2007).

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