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系統識別號 U0026-2808201720412700
論文名稱(中文) 封膠黏彈特性分析及其於條形封裝翹曲模擬之應用
論文名稱(英文) Analysis of Viscoelastic Behavior of Epoxy Molding Compound and its Application in the Warpage Simulation of Strip Molded Electronic Packages
校院名稱 成功大學
系所名稱(中) 機械工程學系
系所名稱(英) Department of Mechanical Engineering
學年度 105
學期 2
出版年 106
研究生(中文) 殷煒傑
研究生(英文) Wei-Jie Yin
學號 N16044488
學位類別 碩士
語文別 中文
論文頁數 84頁
口試委員 指導教授-屈子正
口試委員-陳鐵城
口試委員-陳國聲
口試委員-陳重德
中文關鍵字 封膠  黏彈  翹曲  物理老化 
英文關鍵字 epoxy molding compound  viscoelastic  physical aging  strip warpage 
學科別分類
中文摘要 電子元件在封裝製程中,若產生過大翹曲將導致連結對位不易而使產品生產良率降低。近年來消費性電子產品快速發展,具備多樣性的功能,內部積體電路元件更走向輕、薄、短、小及更多I/O腳位的趨勢元件翹曲的影響更為顯著。而在電子產品長時間使用下,翹曲衍生之殘留應力也易造成元件提早失效。由於電子封裝中的封膠高分子複合材料,具有明顯的黏彈性行為且在不同的溫度下會發生硬化、化學與物理老化反應,這些反應都會造成材料體積上的變化,進而使封裝體產生翹曲,為了更準確預測翹曲行為,正確描述封裝體上材料本構行為是必要的。
本文針對封膠材料受到物理老化影響進行評估,並對封膠材料進行黏彈性行為量測,分為應力鬆弛與潛變試驗,比較兩種實驗方式所顯現出的黏彈行為是否一致,最後與由動態頻率掃描量測所建構的黏彈模型進行比對,探討物理老化對封膠材料的黏彈行為所產生的變化,以及在不同溫度下物理老化影響封膠材料體積變化。
我們藉由封膠黏彈模型對薄型細間距球柵陣列條形封裝件以有限元素法模擬其受溫度變化下的翹曲量,並與實際相關量測實驗結果進行比較。結果發現模擬雖能預估溫度改變對翹曲之影響,但無法準確的預測最終之翹曲量,經過封膠之硬化收縮與成型釋放壓之膨脹估算,可見物理老化對翹曲有明顯之影響。
英文摘要 Epoxy molding compound (EMC) is widely used in electronic packages for encapsulating the Si die. During packaging thermal processes, the thermal expansion mismatch between various packaging materials and physical or chemical aging induced EMC volume change would lead to residual stress and warpage. For the purpose of accurately predicting warpage and residual stress in the overmolded electronic packages, the viscoelastic constitutive behavior and the physical aging characteristics were investigated in this study. The viscoelastic behavior of the EMC were measured by quasi-static stress relaxation and creep experiments. Consistency of the viscoelastic behaviors measured from these two experiments were examined and compared to the viscoelastic model constructed from time-harmonic oscillation experiment. From the comparisons between the results of these different characterization approaches, it was found that the viscoelastic behavior measured by creep and relaxation tests are highly consistent, and the presence of physical aging in the test specimen delays the viscoelastic relaxation. In addition, physical aging leads to additional EMC volume shrinkage after cooling from above to below glass transition temperature. Warpage simulations for molded package strips by using the viscoelastic models were validated by the experimentally measured values. It was shown that the strip warpage is significantly influenced by viscoelastic relaxation and physical aging of the EMC.
論文目次 摘要 I
英文延伸摘要 II
致謝 XIII
表目錄 XVII
圖目錄 XVIII
符號說明 XXII
第一章 緒論 1
1.1 研究背景與動機 1
1.2 文獻回顧 2
1.2.1 高分子黏彈材料特性 2
1.2.2 封裝翹曲與模擬應用 5
1.3 研究目的與方法 7
第二章 理論基礎 9
2.1 物理老化 9
2.2 高分子材料之線黏彈行為 12
2.2.1 線黏彈材料之基本數學模型 14
2.2.2 線黏彈行為之疊合原理 16
2.2.3 線黏彈本構模型 18
2.2.4 時間─溫度疊合(time-temperature superposition , TTS)原理 20
2.2.5 數值轉換近似法 22
第三章 封膠特性量測與分析 25
3.1封膠材料與試件製備 25
3.2 物理老化黏彈特性量測 26
3.2.1 應力鬆弛實驗 27
3.2.2 潛變實驗 38
3.2.3 比較與討論 47
3.3 物理老化過程中的體積變化 53
3.4 模擬製程回冷過程實驗 58
第四章 條形封裝翹曲模擬應用 61
4.1 8x9 超薄型細間距球柵陣列條形封裝件 61
4.1.1 有限元素模型建立 61
4.1.2 材料性質 62
4.1.3 翹曲實驗量測 64
4.1.4 翹曲模擬與實驗比較分析 66
4.2 8x6 超薄型細間距球柵陣列條形封裝件 68
4.2.1 有限元素模型建立 68
4.2.2 材料性質 69
4.2.3 翹曲模擬與實驗比較分析 71
第五章 結論與未來研究 78
5.1 結論 78
5.2 未來研究 79
參考文獻 80
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