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系統識別號 U0026-2108201812534800
論文名稱(中文) 散出型晶圓級構裝製程之翹曲與晶粒偏移分析與改善
論文名稱(英文) Warpage and Die-shift Analyses for Fan-out Wafer Level Packaging
校院名稱 成功大學
系所名稱(中) 機械工程學系
系所名稱(英) Department of Mechanical Engineering
學年度 106
學期 2
出版年 107
研究生(中文) 楊承穎
研究生(英文) Cheng-Ying Yang
學號 N16054394
學位類別 碩士
語文別 中文
論文頁數 192頁
口試委員 指導教授-陳國聲
共同指導教授-楊天祥
口試委員-屈子正
口試委員-于劍平
中文關鍵字 晶圓重組  晶粒偏移  晶圓翹曲  有限元素分析 
英文關鍵字 Wafer reconstitution  Die-shift  Wafer Warpage  Finite element analysis 
學科別分類
中文摘要 晶圓重組的封裝技術相對於傳統封裝技術,所建構出的晶片尺寸更小、擁有更好的I/O接點數與性能並且能降低生產成本,因此具備著極大的優勢潛力。製程中必須經歷一系列壓模、後熟化、卸除載盤等製程,然而在過程中包含多組製程與材料參數的綜合效應,例如溫度、時間與材料的相關特性,倘若在參數組合挑選不佳的情況下,缺陷就可能隨之產生。因此,本文擬透過有限元素數值方法針對製程中的晶粒偏移(die-shift)與晶圓翹曲(wafer warpage)現象作細部的分析,將完整之製程加入至數值模型的分析中,包含壓模過程到後續缺陷的光學檢測的部分,研究中將搭配相關實驗以獲取材料參數以及進行上述缺陷的驗證,進階探討各參數的效應以減少晶粒偏移與結構翹曲的現象。經由整體製程的分析與評估,觀察到壓模封膠(molding compound)與其關聯的固體力學因素為影響晶粒偏移與翹曲的關鍵因子,並藉由數值模型進行綜合探討後,提出改善晶粒偏移與結構翹曲以及減少不對稱晶圓翹曲的建議,並建立製程中的關鍵參數分析以達到參數最佳化,以及提升整體重組製程良率的目標。
英文摘要 Wafer reconstitution is a vital process for serving as a buffer to decouple the processing developments between IC fabrication and electronics packaging. By this approach, the IC packaging is then independent from the chip processing. However, such a process brings numerous mechanical loadings during molding and curing phases. Without carefully planning, failures such as die-shifting and excessive wafer warpages are frequently reported and it induces problems for subsequent processing. In this work, it is desired to examine the key factor of die-shift and wafer warpage by performing finite element analyses, as well as essential parameters study. Preliminarily, the die-shift and warpage problems are deduced as interaction of fluid load, thermal expansion, shrinkage of molding compound and viscoelastic effect. To have a deeper insight, complete finite element analyses of the entire Recon procedure, from molding and thermal-related processes to inspection-related gravity effect, have been constructed to examine the involved phenomenon comprehensively. Compared with experiment, simulation of FE model has a consistent tendency with actual situation and is close to the observed defects. It is found that thermal-mechanical factors such as thermal expansion and residue stress have more influence on die-shift than mold flow effect. In addition, FE result shows that issue of unsymmetrical warpage is related to layout of dies and overall stiffness of reconstituted wafers. Furthermore, by parameters study based on FE models, key parameters with high sensitivity could be identified to optimize the Recon process. The proposed improving solutions are expected to reduce 20 to 30 percentage of initial die-shift and warpage for a better yield rate.
論文目次 摘要 I
Abstract II
Extended Abstract III
致謝 XXXVII
目錄 XXXIX
表目錄 XLV
圖目錄 XLVI
符號及縮寫表 LVI
第一章 緒論 1
1.1前言 1
1.2研究動機與目的 5
1.3 文獻回顧 7
1.4研究方法 10
1.5本文架構 12
第二章 晶圓重組製程介紹 14
2.1本章介紹 14
2.2晶圓重組製程 15
2.3封膠材料特性 19
2.4晶粒偏移與封裝翹曲 22
2.4.1晶粒偏移 22
2.4.2晶圓翹曲 26
2.5晶圓翹曲之力學行為 30
2.6封裝中的翹曲與偏移缺陷分析與對策 35
2.7本章總結 38
第三章 研究方法總論 39
3.1本章介紹 39
3.2重組製程中的重要因素分析 40
3.2.1製程缺陷中的模流因素 40
3.2.2製程缺陷中的固體力學因素 43
3.3實驗系統架構 47
3.4模流階段中的數值模型建立 49
3.5數值分析模型建立 50
3.5.1模流單晶粒模型 50
3.5.2三維數值模型 51
3.5.3二維軸對稱數值模型 53
3.6本章總結 55
第四章 材料性質量測與製程缺陷檢測 56
4.1本章介紹 56
4.2實驗系統規劃與建立 57
4.3材料實驗結果 62
4.3.1 底膠實驗流程與結果 62
4.3.2 封膠實驗流程與結果 65
4.4製程之晶粒偏移與翹曲檢測 69
4.5實驗討論 71
4.6本章總結 73
第五章 晶粒偏移之有限元素分析 74
5.1本章介紹 74
5.2壓模製程中的晶粒偏移分析 75
5.2.1模流分析簡要介紹 76
5.2.2單晶粒模型建立 78
5.2.3單晶粒模型之晶粒偏移分析 79
5.3壓模後製程之晶粒偏移 84
5.3.1有限元素模型建立 86
5.3.2熱機械製程模擬 90
5.3.3製程模擬結果討論 94
5.4晶粒偏移之整體討論 99
5.5本章總結 101
第六章 晶圓翹曲之有限元素分析 102
6.1本章介紹 102
6.2熱機械製程中的翹曲分析 103
6.2.1 晶圓之翹曲外型分析 103
6.2.2 熱機械製程之數值分析結果 109
6.3光學檢測中的翹曲分析 117
6.3.1翹曲檢測中的分析歸類 118
6.3.2翹曲檢測之有限元素模擬建立 120
6.3.3翹曲檢測之模擬結果討論 121
6.4翹曲行為的整體分析與討論 125
6.5本章總結 128
第七章 重組製程之參數分析 129
7.1本章介紹 129
7.2重組製程中的參數介紹與分析 130
7.3重組製程之材料參數分析 133
7.4重組製程之製程參數分析 138
7.5封膠參數的延伸討論 144
7.6參數之綜合與延伸討論 148
7.7本章總結 153
第八章 研究結果與討論 154
8.1全文歸納 154
8.2 研究結果討論 156
8.2.1 製程缺陷之因素探討 156
8.2.2 數值模型中翹曲與偏移之評估結果 157
8.2.3 重組製程之參數分析 158
8.2.4 模流效應之快速評估 160
8.2.5本文結果於工程應用與建議 162
8.3未來展望與未來工作 163
8.4本章總結 165
第九章 結論與未來展望 166
9.1本文結論 166
9.2本文貢獻 169
9.3未來工作 171
參考文獻 172
附錄A1 固化效應之模流分析 179
附錄A2 熱機械製程之ABAQUS程式節錄 186
自述 191

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