進階搜尋


 
系統識別號 U0026-1808201120064300
論文名稱(中文) 薄膜覆晶封裝最佳化及介面分析
論文名稱(英文) Optimization and Interface Analysis of Chip on Film Packaging
校院名稱 成功大學
系所名稱(中) 工程科學系碩博士班
系所名稱(英) Department of Engineering Science
學年度 99
學期 2
出版年 100
研究生(中文) 顏煜唐
研究生(英文) Yu-Tang Yen
電子信箱 n9894131@mail.ncku.edu.tw
學號 n9894131
學位類別 博士
語文別 英文
論文頁數 98頁
口試委員 指導教授-林裕城
口試委員-李旺龍
口試委員-吳德和
口試委員-方得華
口試委員-黃義佑
中文關鍵字 薄膜覆晶封裝  有限元素法  信賴性  田口式方法 
英文關鍵字 Chip on film  finite element method  reliability  Taguchi method 
學科別分類
中文摘要 近年來,軟性電子產品發展相當迅速,已經廣泛用於半導體產業、行動電話,個人數位助理器,筆記型電腦及其他通訊工具和液晶顯示器,由於大面積應用和低成本的原因,已經被廣泛用於上述之產業。薄膜覆晶封裝具有超薄輕巧、彎曲率大及快速量產之潛力,常用於電子產品,生產製程採用網版印刷技術,將油墨印刷在可彎曲的薄膜覆晶封裝作為保護線路,然而,對於軟性材料薄膜覆晶封裝卻很少對其研究,本研究針對在薄膜覆晶封裝上之油墨SN9000做了不同烘烤條件後油墨一致性及成分變化,使用傅立葉轉換紅外光儀器分別檢測使用和未使用高壓烘烤測試,實驗結果可以從傅立葉轉換紅外線光譜可以明顯得知,實驗樣品並未產生成分破壞或是變異。SN9000材料具有優良的烘烤能力,印刷容易性、耐低溫,抗彎曲性避免線路龜裂及填充材料的絕緣性和可靠性,探討將結構設定上下層為聚醯亞胺膜而油墨為中間黏著層,中間油墨層左右兩端假設方形及1/4圓,當外力施加時對於軸向應力及剪應力之分析,應力分佈沿著油墨黏著層的長度逐一分析,並且兩者情況做比較,由模擬結果可以明顯得知,這兩種結構模擬分析之者的von Mises stress均低於降伏強度。
在薄膜覆晶封裝製程中良率改善最主要在印刷製程,由於線俓相當小已經在30 μm左右,因此會有針孔不良品產生,而整體影響針孔產生包含了油墨量、原點控制距離、刮刀角度、油墨攪拌方式、油墨新鮮度、印刷速度及回墨刀的速度,這些參數值均會影響針孔的產生。我們使用了田口式方法,設計了二個水準之直交表,利用直交表方式得到訊號雜訊比,並利用變異數分析及F-檢定方式,找出影響針孔最重要之參數,以便於改善不良率,我們可以從實驗結果得知油墨量及印刷速度為顯著因子及貢獻度為最大,而其結果信心水準超過95%,可以明顯得知這兩個參數將嚴重影響針孔之產生。除此之外,我們也使用產業界最常使用製程能力指標方式,檢驗整體之結果,製程能力指標低於1.0以下代表著這個參數嚴重有問題,必須要長時間觀察及立即改善,當製程能力指標在1.0到1.33時,屬於可被接受範圍,使用最佳化設計前製程能力指標為0.27,當導入最佳化參數時,製程能力指標可高達1.1,代表的整體實驗成效是可以被接受。綜合應力分析及印刷最佳化之可行性研究顯示,熟諳與善用油墨之基礎物理特性,並結合相關之印製製程技術,即可製作出具高品質與高良率之軟性電子感測器、亦可實現與開發低成本製作與大面積感測應用之軟性電子產業。
英文摘要 In recent years, flexible electronics have been developed for use in semiconductors, cellular phones, personal digital assistants, notebooks and liquid crystal displays due to their wide range of application and low cost manufacturing. Chip on film devices can be bent, expanded, and manipulated during use. In addition, flexible electronics made with a solder mask can be patterned onto thin films using screen-printing technologies. Furthermore, the chip on film characteristics of flexible materials have yet to be completely investigated with regard to applications in their fabrication processes. The SN9000 has excellent curability and printability, as well as low temperature bending resistance adhesion to the underfill material. By examining an interferogram of a specimen and using the Fourier transform, the specimen’s single beam spectrum can be obtained before and after the pressure cooker test. The data indicate there was no variation in chemical composition, even after testing with different curing conditions.
The stress field in single-lap joints with square and spew geometries was simulated by the finite element method. The stress distribution across the lap length at the interface for joints with spew ends was compared to that of the square ended single lap joints. The maximum magnitude of the von Mises stress was less than the yield strength of the substrate material. These results reveal that the von Mises stress is less than the yield strength of SN9000.
Yield improvement is the most challenging part of chip on film manufacturing in view of its processing complexity, mainly in the screen-printing process. The process parameters, such as ink capacity, origin control distance, angle of squeeze, method of mixing, freshness of ink, speed of printing, and speed of scraper are all considered in this work with the aim of improving the pinhole. Using the Taguchi method, a two-level orthogonal array is utilized to determine the signal-to–noise (S/N) ratio. Analysis of variance and the F-test values are used to determine the most significant process parameters affecting the pinhole. Ink capacity and speed of printing are found to be significant and important, as their confidence levels reach over 95%. This study thus optimizes these two design factors to improve the quality of pinholes on the chip on film. A capability index (Cpk) of less than 1.0 needs to be improved, while one that is more than 1.0 is usable. Based on the results of the Taguchi method it is possible to select the optimized factors to improve the screen printing process. The results show that Cpk is 1.1 and the quantity of the samples is suitable. The feasibility studies show that the printing technology investigated in this work is appropriate for optimization applications, and that it can be used for the low-cost fabrication of flexible electronics.
論文目次 Abstract I
Chinese Abstract III
Acknowledgements V
List of Figure Captions VIII
List of Table Captions XII
Chapter 1 Introduction 1
1.1 Flexible electronics 1
1.2 Literature review 2
1.2.1 Chip on film 2
1.2.2 Screen printing 3
1.2.3 Taguchi method 4
Chapter 2 Materials and methods 6
2.1 Pressure cooker test 9
2.2 Fourier transform infrared 10
2.3 Coulometric method of plating thickness 13
Chapter 3 Finite element modeling and simulating 16
3.1 Theoretical analysis 16
3.2 Finite element analysis 20
Chapter 4 Screen-printing and Taguchi method 34
4.1 Screen-printing method 34
4.2 Screen manufacturing process 39
4.3 Taguchi method 45
4.4 Modern quality control and quality monitoring of processes 51
Chapter 5 Results and discussion 55
5.1 Results of material reliability test 55
5.2 Results of Tg response to temperature 60
5.3 Results of the theoretical and experimental analysis 62
5.4 Results of stress analysis 64
5.5 Results of S/N ratio 69
5.6 Results of analysis of variance 71
5.7 Results of confirmation test 72
5.8 Results of Cpk and control chart 75
Chapter 6 Conclusions and future works 78
6.1 Conclusions 78
6.2 Future works 80
References 81
Biography 96
Publications 97
參考文獻 [1] I. Watanae, T. Fujinawa and M. Arifuku, “Recent advances of interconnection technologies using anisotropic conductive films in flat panel display applications,” in: Proc Int’l Symposium on Advanced Packaging Material, Atlanta, GA, USA, Mar., pp. 11-16, 2004.
[2] D.E. Pope and H.T. Do, “Thermal characterization of a tape carrier package,” IEEE Trans Compon Packaging Technol, 18, pp. 78-81, 1995.
[3] M. Ohsono, T. Iwane and H. Uchida, “The development of a new resin with high mechanical strength at a high temperature of TCP’s,” in: Proc Electronic Components and Technology Conference, Orlando, Florida, Jun., pp. 582-587, 1998.
[4] C. Jang, S. Han and H. Kim, “A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process,” Microelectron Reliab, 48, pp. 487-495, 2006.
[5] R. Fillion, B. Burdick, P. Piacente, L. Douglas and D. Shaddock, “Reliability evaluation of chip-on-flex CSP devices,” International Conference on Multichip Modules and High Density Packaging, pp. 242-246, 1998.
[6] J. Tjandra, C.L. Wong, J. How and S. Peana, “Au-Sn microsoldering on flexible circuit,” IEEE/CPMT Electronic Packaging Technology Conference, pp. 52-57, 1997.
[7] Y. Endo and T. Furuichi, “Punching technique of TAB tape carrier for matrix via hole pattern,” Hitachi Cable Review, 20, pp. 57-62, 2004.
[8] Y.C. Chan, K.C. Hung, C.W. Tang and C.M.L. Wu, “Degradation mechanisms of anisotropic conductive adhesive joints for flip chip on flex applications,” Adhesive Joining and Coating Technology in Electronics Manufacturing Proceeding 4th International Conference, pp. 141-146, 2000.
[9] F. Ferrando, J.F. Zeberli, P. Clot and J.M. Chenuz, “Industrial approach of a flip-chip method using the stud-bumps with a non-conductive paste,” Adhesive Joining and Coating Technology in Electronics Manufacturing Proceeding 4th International Conference. pp. 205-211, 2000.
[10] S.M. Chang, J.H. Jou and A. Hsieh, “Characteristic study of anisotropic-conductive film for chip-on-film packaging,” Microelectron Reliab, 41, pp. 2001-2009, 2001.
[11] G.S. Datta and D.D. Smith, “On propriety of posterior distributions of variance components in small area estimation,” J Stat Plan Infer, 112, pp. 175-183, 2003.
[12] H. Dreuth and C. Heiden, “A method for local application of thin organic adhesive films on micropatterned structures,” Mater Sci Eng A-Struct Mater Prop Microstruct Process, 5, pp. 227-231, 1998.
[13] M.C. Huang and C.C. Tai, “The effective factors in the warpage problem of an injection-molded part with a thin shell feature,” J Mater Process Technol, 110, pp. 1-9, 2001.
[14] K. Cho and I. Jeon, “Numerical analysis of the warpage problem in TSOP,” Microelectron Reliab, 44, pp. 621-626, 2004.
[15] G.E. Jabbour and N. Peyghambarian, “Screen printing for the fabrication of organic light-emitting devices,” IEEE J Sel Top Quantum Electron, 7, pp. 769-773, 2001.
[16] T.X. Liang and L.D. Wang, “Effect of surface energies on screen printing resolution,” IEEE Trans Compon Packaging Technol, 19, pp. 423-426, 1996.
[17] B. Riviere and C. Pijolat, “Development of tin oxide material by screen-printing technology for micro-machined gas sensors,” Sens Actuator B-Chem, 1-3, pp. 531-537, 2003.
[18] T.H. Yang and R.V. Olmen, “Robust design for a multilayer ceramic capacitor screen-printing process case study,” J Eng Design, 15, pp. 447-457, 2004.
[19] J.P. Viricelle and C. Pijolat, “Optimization of SnO2 screen-printing inks for gas sensor applications,” J European Ceram Soc, 25, pp. 2137-2140, 2005.
[20] R. Parashkov and T. Riedl, “Large area electronics using printing methods,” Proc IEEE, 93, pp. 1321-1329, 2005.
[21] G.E. Jabbour and N. Peyghambarian, “Screen printing for the fabrication of organic light-emitting devices,” IEEE J Sel Top Quantum Electron, 7, pp. 769-773, 2001.
[22] T.X. Liang and L.D. Wang, “Effect of surface energies on screen printing resolution,” IEEE Trans Compon Packaging Technol, 19, pp. 423-426, 1996.
[23] B. Riviere and C. Pijolat, “Development of tin oxide material by screen-printing technology for micro-machined gas sensors,” Sens Actuator B-Chem, 1-3, pp. 531-537, 2003.
[24] T.H. Yang and R.V. Olmen, “Robust design for a multilayer ceramic capacitor screen-printing process case study,” J Eng Design, 15, pp. 447-457, 2004.
[25] S.H. Ross, “Taguchi Techniques for Quality Engineering,” second ed., McGraw-Hill, New York, 1996.
[26] M.C. Huang and C.C. Tai, “The effective factors in the warpage problem of an injection-molded part with a thin shell feature,” J Mater Process Technol, 110, pp. 1-9, 2001.
[27] K. Cho and I. Jeon, “Numerical analysis of the warpage problem in TSOP,” Microelectron Reliab, 44, pp. 621-626, 2004.
[28] S.H. Tang, Y.J. Tan and S.M. Sapuan, “The use of Taguchi method in the design of plastic injection mould for reducing warpage,” J Mater Process Technol, 182, pp. 418-426, 2007.
[29] T.Y. Lin, B. Njoman and D. Crouthamel, “The impact of moisture in mold compound performs on the warpage of PBGA packages,” Microelectron Reliab, 44, pp. 603-609, 2004.
[30] B. Ozcelik and T. Erzurumlu, “Comparison of the warpage optimization in the plastic injection molding using ANOVA neural network model and genetic algorithm,” J Mater Process Technol, 171, pp. 437-445, 2006.
[31] B. Ozcelik and T. Erzurumlu, “Determination of effecting dimensional parameters on warpage of thin shell plastic parts using integrated response surface method and genetic algorithm,” Int Commun Heat Mass Transf, 32, pp. 1085-1094, 2005.
[32] S.L. Liu and G. Chen, “EMC characterization and process study for electronics packaging,” Thin Solid Films, 462-463, pp. 454-458, 2004.
[33] H. Hosseini and B.V. Berdyshev, “A solution for warpage in polymeric products by plug-assisted thermoforming,” Eur Polym J, 42, pp. 1836-1843, 2006.
[34] D.H. Wu and Y.T. Yen, “Robust design of quartz crystal microbalance using finite element and Taguchi method,” Sens Actuator B-Chem, 92, pp. 337-344, 2003.
[35] H. Oktem and T. Erzurumlu, “Application of Taguchi optimization technique in determining plastic injection molding process parameters for a thin-shell part,” Mater Des, 28, pp. 1271-1278, 2007.
[36] R.S. Chen and H.C. Lin, “Optimal dimension of PQFP by using Taguchi method,” Compos Struct, 49, pp. 1-8, 2000.
[37] Y.H. Hung and M.L. Huang, “Optimizing the controller IC for micro HDD process based on Taguchi methods,” Microelectron Reliab, 46, pp. 1183–1188, 2006.
[38] H.C. Lee and O.O. Park, “Round pinholes in indium-tin-oxide thin films on the glass substrates: a Taguchi method analysis and theoretical approach to their origins,” Vacuum, 72, pp. 411-418, 2004.
[39] T.Y. Tee, C.L. Kho and D. Yap, “Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill,” Microelectron Reliab, 43, pp. 741-749, 2003.
[40] C.K. Ryu and J. Huang, “Advanced planarized passivation for sub-micro technology,” Microelectron Reliab, 45, pp. 393-399, 1999.
[41] V.D. Akhmetov and H. Richter, “FTIR spectroscopic system with improved sensitivity,” Mater Sci Semicond Process, 9, pp. 92-95, 2006.
[42] P. Nemeth, “Acccelerated life time test methods for new package technologies,” in: Proc 24th Innternational Spring Seminar on Electronics Technology, pp. 215-219, 2001.
[43] T. Anno, S. Katsuki and H. Unno, “The soot deposited integrated cicuit substrate of 6 inches diameters for high voltage ICs, improved in the durability against the pressure cooker test,” in: Proc Innternational Symposium on Power Semiconductor Devices & ICs, pp. 298-302, 1995.
[44] Y. Kumano, Y. Tomura and M. Itagaki, “Development of chip-on-flex using SBB flip-chip technology,” Microelectron Reliab, 41, pp. 525-530, 2001.
[45] H.K. Yip and W.M. To, “An FTIR study of the effects of artificial saliva on the physical characteristics of the glass ionomer cements used for art,” Dent Mater, 21, pp. 695-703, 2005.
[46] V. Erukhimovitch, V. Pavlov and M. Talyshinsky, “FTIR microscopy as a method for identification of bacterial and fungal infections,” J Pharm Biomed Anal, 37, pp. 1105-1108, 2005.
[47] H. Gao and K. Lian, “Characterizations of proton conducting polymer electrolytes for electrochemical capacitors,” Electrochim Acta, 56, pp. 122–127, 2010.
[48] C. Baudot, C.M. Tan and J.C. Kong, “FTIR spectroscopy as a tool for nano-material characterization,” Infrared Phys Technol, 53, pp. 434-438, 2010.
[49] P. Fu, S. Hua, J. Xianga, P. Li and D. Huanga, “FTIR study of pyrolysis products evolving from typical agricultural residues,” J Anal Appl Pyrolysis, 88, pp. 117-123, 2010.
[50] H. Chen, C. Ferrari, M. Angiulib and J. Yaoa, “Qualitative and quantitative analysis of wood samples by Fourier transform infrared spectroscopy and multivariate analysis,” Carbohydr Polym, 82, pp. 772–778, 2010.
[51] L. Tong and A. Sheppard, “Relationship between surface displacement and adhesive peel stress in bonded double lap joints,” Int J Adhes Adhes, 15, pp. 43-48, 1995.
[52] T. Sawa, K. Ichikawa, Y. Shin and T. Kobayashi, “A three-dimensional finite element stress analysis and strength prediction of stepped-lap adhesive joints of dissimilar adherends subjected to bending moments,” Int J Adhes Adhes, 30, pp. 298-305, 2010.
[53] M.Y. Tsai and J. Morton, “An investigation into the stresses in double-lap adhesive joints with laminated composite adherends,” Int J Solids Struct, 47, pp. 3317–3325, 2010.
[54] L.F.M.da Silva, N.M.A.J. Ferreira, V. Richter-Trummer and E.A.S. Marques, “Effect of grooves on the strength of adhesively bonded joints,” Int J Adhes Adhes, 30, pp. 735–743, 2010.
[55] Y. Zhang, A.P. Vassilopoulos and T. Keller, “Effects of low and high temperatures on tensile behavior of adhesively-bonded GFRP joints,” Compos Struct, 92, pp. 1631–1639, 2010.
[56] Y.H. Lee, D.W. Lim and J.H. Choi, “Failure load evaluation and prediction of hybrid composite double lap joints,” Compos Struct, 92, pp. 2916–2926, 2010.
[57] G. Challita and R. Othman, “Finite-element analysis of SHPB tests on double-lap adhesive joints,” Int J Adhes Adhes, 30, pp. 236–244, 2010.
[58] R.D.S.G. Campilho, M.F.S.F. de Moura and J.J.M.S. Domingues, “Modelling single and double-lap repairs on composite materials,” Compos Sci Technol, 65, pp. 1948–1958, 2005.
[59] J.Y. Cognard and L. Sohier, “Numerical analysis and optimisation of cylindrical adhesive joints under tensile loads,” Int J Adhes Adhes, 30, pp. 706–719, 2010.
[60] A.D. Diaz, G. Foret and A. Ehrlacher, “Stress analysis in a classical double lap, adhesively bonded joint with a layerwise model,” Int J Adhes Adhes, 29, pp. 67–76, 2009.
[61] T.P. Lang and P.K. Mallick, “Effect of spew geometry on stresses in single lap adhesive joints,” Int J Adhes Adhes, 18, pp. 167-177, 1998.
[62] Y.T. Yen, T.H. Fang and Y.C. Lin, “Reliability and Stress Analysis of Ink for Chip on Film Packaging,” IEEE Trans Compon Packaging Technol, 33, pp. 299-306, 2010.
[63] M. Sunar and B.S. Yilbas, “Thermal and stress analysis of a sheet metal in welding,” J Mater Process Technol, 172, pp. 123-129, 2006.
[64] A.G. Magalhães and J.P.M. Goncalves, “Evaluation of stress concentration effects in single-lap bonded joints of laminate composite materials,” Int J Adhes Adhes, 25, pp. 313-319, 2005.
[65] Q. Tao and H.P. Lee, “Contact mechanics of surfaces with various models of roughness descriptions,” Wear, 249, pp. 539-545, 2001.
[66] K. Kim and J. Yi, “A novel approach for co-firing optimization in RTP for the fabrication of large area mc-Si solar cell,” Thin Solid Films, 511-512, pp. 228-234, 2006.
[67] M.A. de la Rubia, M. Peiteado, J. de Frutos and F. Rubio-Marcos, “Improved non-linear behaviour of ZnO-based varistor thick films,” J Eur Ceram Soc, 27, pp. 3887–3891, 2007.
[68] R.O. Kadara, N. Jenkinson and C.E. Banks, “Screen printed recessed microelectrode arrays,” Sens Actuator B-Chem, 142, pp. 342-346, 2009.
[69] D. Erath, A.M. Retzlaff and A.K. Goetz, “Advanced screen printing technique for high definition front side metallization of crystalline silicon solar cells,” Sol Energy Mater So Cells, 94, pp. 57-61, 2010.
[70] A. Ryan and H. Lewis, “Manufacturing an environmentally friendly PCB using existing, industrial processes and equipment,” Robot Comput-Integr Manuf, 23, pp. 720-726, 2007.
[71] B. Neral, “Properties of UV-cured pigment prints on textile fabric,” Dyes Pigment, 68, pp.143-150, 2006.
[72] D.Y. Lee, H.H. Lee, J.Y. Ahn and H.J. Park, “A new back surface passivation stack for thin crystalline silicon solar cells with screen-printed back contacts,” Sol Energy Mater Sol Cells, 95, pp. 26-29, 2011.
[73] H. Zhang, S. Jiang and K. Kajiyoshi, “Preparation and characterization of sol–gel derived sodium–potassium bismuth titanate powders and thick films deposited by screen printing,” J Alloy Compd, 495, pp. 173-180, 2010.
[74] S. Merilampi, T. Laine-Ma and P. Ruuskanen, “The characterization of electrically conductive silver ink patterns on flexible substrates,” Microelectron Reliab, 49, pp. 782-790, 2009.
[75] D.Y. Shin, Y. Lee and C.H. Kim, “Performance characterization of screen printed radio frequency identification antennas with silver nanopaste,” Thin Solid Films, 517, pp. 6112–6118, 2009.
[76] N.B. Clark and L.J. Maher, “Non-contact, radio frequency detection of ammonia with a printed polyaniline sensor,” React Funct Polym, 69, pp. 594–600, 2009.
[77] J. M. Verilhac, M. Benwadih, A. L. Seiler and S. Jacob, “Step toward robust and reliable amorphous polymer field-effect transistors and logic functions made by the use of roll to roll compatible printing processes,” Org Electron, 11, pp. 456–462, 2010.
[78] D.E. Pachucki, “Environmental stress testing experiment using the Taguchi method,” IEEE Trans Compon Packaging Technol, 18, pp. 3-9, 1995.
[79] M. Sheoran, A. Upadhyaya and A. Rohatgi, “A comparison of bulk lifetime, efficiency, and light-induced degradation in boron- and Gallium-Doped cast mc-Si solar cells,” IEEE Trans Electron Devices, 53, pp. 2764-2772, 2006.
[80] J.W. Kim, Y.C. Lee, J.M. Kim and W. Nah, “Characterization of direct patterned Ag circuits for RF application,” Microelectron Eng, 87, pp. 379-382, 2010.
[81] S.K. Chen, P. Mangiameli and C.J. Roethlein, “Predicting the output of atube-bending process: A case study,” Int J Prod Econ, 95, pp. 307-316, 2005.
[82] B.K. Rout and R.K. Mittal, “Optimal manipulator parameter tolerance selection using evolutionary optimization technique,” Eng Appl Artif Intell, 21, pp. 509–524, 2008.
[83] M. Zeng, L.H. Tang, M. Lin and Q.W. Wang, “Optimization of heat exchangers with vortex-generator fin by Taguchi method,” Appl Therm Eng, 30, pp. 1775-1783, 2010.
[84] D. Yu, C. Wang, X. Cheng and F. Zhang, “Optimization of hybrid PVD process of TiAlN coatings by Taguchi method,” Appl Surf Sci, 255, pp. 1865–1869, 2008.
[85] S.M. Kim, K.S. Park, K.D. Kim and S.D. Park, “Optimization of parameters for the synthesis of bimodal Ag nanoparticles by Taguchi method,” J Ind Eng Chem, 15, pp. 894–897, 2009.
[86] S. Kumar, P. Kumar, H.S. Shan, “Optimization of tensile properties of evaporative pattern casting process through Taguchi’s method,” J Mater Process Technol, 204, pp. 59-69, 2008.
[87] S. Ebrahimiasl, W.M.Z.W. Yunus and A. Kassim, “Prediction of grain size, thickness and absorbance of nanocrystalline tin oxide thin film by Taguchi robust design,” Solid State Sci, 12, pp. 1323-1327, 2010.
[88] K.N. Ballantyne, R.A. van Oorschot and R.J. Mitchell, “Reduce optimisation time and effort: Taguchi experimental design methods,” Forensic Sci Int-Genet, 1, pp. 7-8, 2008.
[89] H. Ye, S. Xue, L. Zhang, F. Ji and W. Dai, “Reliability evaluation of CSP soldered joints based on FEM and Taguchi method,” Comput Mater Sci, 48, pp. 509–512, 2010.
[90] S.J. Wu, K. Ouyangb and S.W. Shiah, “Robust design of microbubble drag reduction in a channel flow using the Taguchi method,” Ocean Eng, 35, pp. 856-863, 2008.
[91] S.S. Mahapatra and A. Patnaik, “Study on mechanical and erosion wear behavior of hybrid composites using Taguchi experimental design,” Mater Des, 30, pp. 2791–2801, 2009.
[92] S. Biswas and A. Satapathy, “Tribo-performance analysis of red mud filled glass-epoxy composites using Taguchi experimental design,” Mater Des, 30, pp. 2841–2853, 2009.
[93] A.J. van der Merwe and D. Chikobvu, “A process capability index for averages of observations from new batches in the case of the balanced random effects model,” J Stat Plan Infer, 140, pp. 20-29, 2010.
[94] W.C. Lee, J.W. Wu and C.W. Hong, “Assessing the lifetime performance index of products with the exponential distribution under progressively type II right censored samples,” J Comput Appl Math, 231, pp. 648-656, 2009.
[95] A. Al-Refaie and N. Bata, “Evaluating measurement and process capabilities by GR&R with four quality measures,” Measurement, 43, pp. 842–851, 2010.
[96] M.Y. Liao and C.W. Wu, “Evaluating process performance based on the incapability index for measurements with uncertainty,” Expert Syst Appl, 37, pp. 5999–6006, 2010.
[97] C.S. Lin, J.T. Huang, T.C. Wei and M.S. Yeh, “High speed and high accuracy inspection of in-tray laser IC marking using line scan CCD with a new calibration model,” Opt Laser Technol, 43, pp. 218–225, 2011.
[98] A. Quijano and E.N. Morandi, “Post-flowering leaflet removals increase pod initiation in soybean canopies,” Field Crop Res, 120, pp. 151-160, 2011.
[99] W.L. Pearn and M.Y. Liao, “Measuring process capability based on CPK with gauge measurement errors,” Microelectron Reliab, 45, pp. 739–751, 2005.
[100] G.H. Lin, “A Bayesian approach based on multiple samples for measuring process performance with incapability index,” Int J Production Economics, 106, pp. 506–512, 2007.
[101] D.K. Huang and C.F. Chen, “Optical transmission inspection of the basis weight using the piecewise least squares method and quality capability of process,” Opt Commun, 284, pp. 838–846, 2011.
[102] W.L. Pearn and C.W. Wu, “An effective decision making method for product acceptance,” Omega-Int J Manage Sci, 35, pp. 12-21, 2007.
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