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系統識別號 U0026-1608201110550100
論文名稱(中文) 晶圓薄化研究
論文名稱(英文) Research on Wafer Thinning
校院名稱 成功大學
系所名稱(中) 工程科學系專班
系所名稱(英) Department of Engineering Science (on the job class)
學年度 99
學期 2
出版年 100
研究生(中文) 徐文禮
研究生(英文) Wen-Li Hsu
學號 N9797136
學位類別 碩士
語文別 中文
論文頁數 74頁
口試委員 指導教授-周榮華
口試委員-黎靖
口試委員-趙守嚴
中文關鍵字 晶圓  平坦度  Die Strength  Die Crack 
英文關鍵字 wafer  flatness  Die Strength  Die Crack 
學科別分類
中文摘要 隨著晶片3D堆疊 (3D-Stacked Die)技術的蓬勃發展,為了在有限的空間裡,讓系統功能極大化,晶圓(Wafer)的薄化面臨更大的挑戰。由於晶圓尺寸從8吋(8 inch)提升到12吋(12 inch) ,故在封裝製程的研磨中,晶圓(Wafer)的平坦度(Flatness)及表面應力分佈將面臨更嚴苛的挑戰。若製程上控制不當則易造成破片(Breaking),導致IC元件損壞及嚴重的成本損失。本次研究主要是針對現有的設備,在第一站研磨站就提升Die Strength ,以降低後製程所產生的Die Crack 。藉由研磨機工作台轉速與主軸轉速及進給速率,三者關係互相組合,找出對Die Strength 最大化的組合。此次利用的工具為田口實驗,藉由田口找出最佳化的組合。
英文摘要 With the 3D stacking packages (3D-Stacked Die) rapidly progressed and the need to utilize the limited space, maximize the system function, the wafer thinning will face even greater challenges. As wafer sizes increase from 8 inches to 12 inches , in grinding process, the wafer flatness and surface stress distribution will face more severe challenges . If inadequate control of the manufacturing process occurs, it is easy to cause fragmentation, IC component damage and lead to serious cost losses. This study focuses on existing factory equipment, the first station grinding station to enhance die strength, and to reduce post process resulted from die crack. Die strength is maximized by examining the grinding machine table speed ,the spindle speed the feed rate, and the relationship among each combination. Through the Taguchi experiment, the optimal combination of process condition is obtained.
論文目次 中文摘要 -----------------------------------------------I
Abstract ----------------------------------------------II
誌謝---------------------------------------------------III
目錄 --------------------------------------------------IV
圖目錄 -------------------------------------------------VI
表目錄 -------------------------------------------------IX

第一章 緒論
1.1 前言 ------------------------------------------1
1.2 研究動機及目的 ------------------------------------2
1.3 Flash Memory Card應用及演進 ----------------------3
1.4 文獻回顧 ----------------------------------------16

第二章 3D封裝製程
2.1 封裝型態------------------------------------------21
2.2 3D IC 封裝製程介紹 -------------------------------28
2.3 研磨製程 -----------------------------------------37

第三章 研究設計與方法
3.1 設計方法與流程-----------------------------------43
3.2 實驗機台與材料條件--------------------------------43
3.3 收集資料與結果檢測 -------------------------------47

第四章 田口氏品質工程分析
4.1 田口品質設計法之實驗設計---------------------------49
4.2 實驗結果-----------------------------------------52
4.3 變異分析 ----------------------------------------58
4.4 確認實驗-----------------------------------------60

第五章 結論與未來研究方向
5.1 結論--------------------------------------------67
5.2 未來研究方向 ------------------------------------68

參考文獻---------------------------------------------69

名詞縮寫之全文對照-------------------------------------73
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