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系統識別號 U0026-1507201901264600
論文名稱(中文) 薄型QFN封裝側面撞擊產生之破壞分析與改善
論文名稱(英文) Fracture Analysis and Improvement of Extra Thin QFN Electronic Package under Side Impact
校院名稱 成功大學
系所名稱(中) 工程科學系碩士在職專班
系所名稱(英) Department of Engineering Science (on the job class)
學年度 107
學期 2
出版年 108
研究生(中文) 許峻嘉
研究生(英文) Chun-Chia Hsu
學號 N97061251
學位類別 碩士
語文別 中文
論文頁數 52頁
口試委員 指導教授-潘文峰
口試委員-王榮泰
口試委員-李國龍
口試委員-張浩元
中文關鍵字 ANSYS-Workbench  薄型QFN  三點彎曲試驗  衝擊 
英文關鍵字 ANSYS-Workbench  Extra Thin QFN Electronic Package  Three-point Bending Test  Side Impact 
學科別分類
中文摘要 本論文使用有限元素分析軟體ANSYS-Workbench分析設備製程動作中的瞬態行為,主要是以軟體模擬方式去匹配實際的實驗結果。研究共分為兩階段進行,第一階段使用電子萬能試驗機進行薄型QFN三點彎曲測試的實驗,取得實際產品失效時的最大破壞荷重與變形量,接著將實驗之最大破壞荷重套入ANSYS軟體進行分析,以觀察該變形量與實際的實驗結果是否相符,以此收斂薄型QFN幾何模型的可靠度;第二階段以驗證過的幾何模型加入供料模組分離器系統的邊界條件,模擬現行設備的製程動作,在假設薄型QFN完美以面撞擊限位塊與產生偏擺並上浮以點撞擊限位塊的兩種型態,找出導致不良品產生的問題。本論文以兩個方案進行改善分析,方案1變更限位塊的材質,以提高吸收衝擊能力;方案2減緩薄型QFN撞擊前的移動速度,以降低衝擊力產生。最後改善結果,不良率由每一百萬顆有33顆不良品,最終下降至每一百萬顆僅有5顆不良品左右,可有效的改善了薄型QFN於供料模組分離器系統的品質。
英文摘要 This research employs the finite element analysis software ANSYS to study the behavior in equipment manufacturing process, and mainly focuses on the comparison between the results of ANSYS simulation and actual experimental data. This research contains two parts, the first part is to use the universal testing machine to conduct three-point bending test on the extra thin QFN electronic packages to obtain the data of the ultimate load and deformation. Next, load the related data to ANSYS, set related conditions to proceed the analysis, observe the deformation corresponding to real situation, and adjust the extra thin QFN electronic package geometry model. The second part is to add the boundary conditions of feed module separator and use ANSYS to simulate the current manufacturing process. Next, determine stress distribution of the defective products under the assumption that the extra thin QFN electronic packages hit the limited block with the flat side and with the sharp point. This thesis considers two improvement plans, plan 1 is to change the material of limited block to have better shock absorbency; plan 2 is to slow down the extra thin QFN electronic packages before it hits the limited block to reduce the shock. The final result shows that the defective rate lowers from 33 pieces to 5 pieces defected per million. The quality of the extra thin QFN electronic packages in feed module separator is greatly improved.
論文目次 目 錄
摘要 ------------------------------------------------------------------ I
Abstract ------------------------------------------------------------- II
致謝 --------------------------------------------------------------- VIII
目錄 ----------------------------------------------------------------- IX
表目錄 -------------------------------------------------------------- XI
圖目錄 ------------------------------------------------------------- XII
符號說明 ---------------------------------------------------------- XIV

第一章、 緒論-------------------------------------------------------- 1
1.1 前言 --------------------------------------------------------------- 1
1.2 研究動機及目的 ------------------------------------------------ 2
1.3 Extra Thin QFN 作業環境簡介 ----------------------------- 3
1.4 測試環境產生的破壞分析魚骨圖 --------------------------- 4
1.5 文獻回顧 --------------------------------------------------------- 5

第二章、 基礎理論 ------------------------------------------------- 7
2.1 封裝製程流程簡介 --------------------------------------------- 7
2.2 塑性基本理論 -------------------------------------------------- 10
2.2.1. 雙線段動態硬化法則 -------------------------------------- 12
2.2.2. 多線段動態硬化法則 -------------------------------------- 12
2.3 物理動量 -------------------------------------------------------- 14
2.4 有限元素法 ----------------------------------------------------- 15
2.4.1 基本概論 ------------------------------------------------------ 15
2.4.2 ANSYS Workbench 軟體介紹 --------------------------- 17

第三章、 薄型QFN於三點彎曲測試之有限元素分析 ------ 21
3.1 實驗目的 -------------------------------------------------------- 21
3.2 實驗設備 -------------------------------------------------------- 21
3.3 實驗結果 -------------------------------------------------------- 22
3.4 ANSYS分析模型 ---------------------------------------------- 23
3.4.1 薄型QFN封裝體堆疊結構 -------------------------------- 23
3.4.2 SolidWorks 模型尺寸 ------------------------------------- 23
3.5 模擬分析邊界條件與模型參數 ---------------------------- 25
3.5.1. 構裝體模型之基本假設條件 ---------------------------- 25
3.5.2. 幾何模型材料機械性質 ---------------------------------- 25
3.5.3. 邊界條件設定 ---------------------------------------------- 26
3.6 模擬模型網格收斂 ------------------------------------------- 27
3.7 模擬結果 ------------------------------------------------------- 29
3.8 實驗與模擬結果比較----------------------------------------- 30

第四章、 薄型QFN於供料分離器之有限元素分析 ------- 34
4.1 問題描述與模擬分析目的 --------------------------------- 34
4.2 供料工站機構環境介紹 ------------------------------------ 34
4.3 分離器之分析模型 ------------------------------------------ 37
4.4 分離器之模擬分析邊界條件與模型參數 --------------- 39
4.4.1. 分離器模擬之基本假設條件 --------------------------- 39
4.4.2. 分離器模擬之模型材料機械性質 --------------------- 39
4.4.3. 分離器模擬之邊界條件 --------------------------------- 39
4.5 模擬分析結果與實際比較 --------------------------------- 41
4.6 改善對策 ------------------------------------------------------ 43
4.6.1. 分離器限位塊材質變更 -------------------------------- 44
4.6.2. 減少推送薄型QFN前進的吹氣量 -------------------- 46
4.7 改善對策後結果 --------------------------------------------- 47

第五章、 結論與建議 -------------------------------------------- 49

參考文獻 ------------------------------------------------------------ 51
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[9]. T. Furushima, H. Tsunezaki, K.-I. Manabe, S. Alexsandrov, “Ductile Fracture and Free Surface Roughening Behaviors of Pure Copper Foils Formicro / Meso-Scale Forming”, ELSEVIER International Journal of Machine Tools & Manufacture, Vol.76, pp. 34-48, 2014.
[10]. 曾詠茹,「有限元素分析不同外徑/壁厚比局部圓形凹痕圓管在循環彎曲負載下之行為」,國立成功大學碩士論文,2016。
[11]. 林倩如,「有限元素分析局部尖銳凹痕圓管在循環彎曲負載下之行為」,國立成功大學碩士論文,2016。
[12]. 高偉倫,「有限元素分析輕鋼架天花板在地震運動時之動態行為」,國立成功大學碩士論文,2016。
[13]. 林青穆,「薄型QFN封裝於測試環境產生之結構破壞分析與改善」,國立成功大學碩士論文,2019。
[14]. H.-H. Lee, Finite Element Simulations with ANSYS Workbench 17, Schroff, 2017.
[15]. G. A. Muñoz, “Mesh Quality and Advanced Topics ANSYS Workbench 16.0”, Published in ACADEMIA, 2015, Take https://www.academia.edu/16970000/MESH_QUALITY_AND_ADVENCED_TOPICS_ANSYS_WORKBENCH_16.0 .
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