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系統識別號 U0026-0908201820483600
論文名稱(中文) 應用封裝於高密度熱電偶之熱電能源採集晶片之研究
論文名稱(英文) Packaging Development of Thermoelectric Energy Generator with High Area Density of Thermocouples
校院名稱 成功大學
系所名稱(中) 航空太空工程學系
系所名稱(英) Department of Aeronautics & Astronautics
學年度 106
學期 2
出版年 107
研究生(中文) 許堯盛
研究生(英文) Yao-Sheng Hsu
學號 p46051173
學位類別 碩士
語文別 英文
論文頁數 70頁
口試委員 口試委員-蔡尚恩
口試委員-陳春志
口試委員-劉育釧
指導教授-楊世銘
中文關鍵字 能源採集器  高密度熱電偶  封裝 
英文關鍵字 Thermoelectric energy generator  High area density  Packaging 
學科別分類
中文摘要 本研究是描述的是一種可以利用溫度差發電的熱電能源採集器,目標為利用台積電中的矽鍺0.18 μm BiCMOS製程設計並製造出1.2 mm×1.2 mm的高輸出電壓熱電能源採集器晶片並且設計出適合該晶片的封裝。透過數值模擬分析,蝕刻窗大小是33 μm×2 μm的熱電能源採集器有最高的輸出電壓係數30.02 V/cm2K。在晶片完成鋁箔膠帶封裝後,蝕刻窗大小是33 μm×3 μm的熱電能源採集器在17度的溫差下有76.29 mV的輸出電壓和18.22 V/cm2K的輸出電壓係數,相較於尚未封裝的晶片依然保留72.1%的輸出電壓,大約28 %的溫差再封裝中散失並且低於前人的研究。根據數值模擬與封裝實驗結果,在20 K的溫差下熱電能源採集器晶片在沒有封裝及有封裝下可以分別輸出2.3 V 與1.7 V的輸出電壓。
英文摘要 This work describes a thermoelectric energy generator (TEG) which generates electrical power by temperature difference. This thesis aims at designing and fabricating a TEG with high output voltage and adaptable packaging. The 1.2 mm×1.2 mm TEG chip is by TSMC SiGe 0.18 μm BiCMOS process. The simulation results show that the TEG with 33 μm×2 μm etching window size has the highest voltage factor at 30.02 V/cm2K. By using the packaging of aluminum tape, the output voltage of the TEG of 3 μm etching window width 76.29 mV at 17 K temperature difference, and the voltage factor is 18.22 V/cm2K which is 72.1 % of the TEG without packaging. This is due to about 28 % temperature difference loss at the packaging, and that is less than the previous works. According to the simulation result and experiment result, the output voltage of TEG chip is 2.3 V without package and the output voltage of TEG chip will be 1.7 V with package at 20 K temperature difference.
論文目次 Contents
Abstract in Chinese…………………………………………………………………...i
Abstract……………………………………………………………………………...vii
Acknowledgement………………………………………………………………….viii
Contents……………………………………………………………………………...ix
List of Tables………………………………………………………………...……….xi
List of Figures……………………………………………………………………….xii
Chapter
1. Introduction………………………………………………………………………..1
1.1 Motivation…………………………………………………………………..1 1.2 Literature Review…………………………………………………………...2
1.3 Outlines……………………………………………………………………..9
2. Design of Thermoelectric Energy Generator…………………………..……….15
2.1 Introduction………………………………………………………………..15
2.2 The Thermoelectric Energy Generator Design…………………………….15
2.3 Etching Window Size……………………………………………….…….18
2.4 Summary …………………………………………………………………..21
3. Post Process and Measurement……………………………………………….…31
3.1 Introduction………………………………………………………………..31
3.2 Post Process of TEG……………………………………………………….31
3.3 Measurement of TEG……………………………………………………...33
3.4 Simulation of TEG…………………………………………………..…….35
3.5 Summary …………………………………………………………………..36
4. Packaging on Thermoelectric Energy Generator………………………..……..51
4.1 Introduction…………………………………………………………..……51
4.2 The process of Packaging……………………………………….…………52
4.3 Reliable Test and Simulation………………………………………………53
4.4 Summary …………………………………………………………………..55
5. Summary and Conclusions………………………………………………………66
References…………………………………………………………………………...68
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