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系統識別號 U0026-0812200915275869
論文名稱(中文) 堆疊式電子封裝元件之翹曲分析
論文名稱(英文) POP IC Package Warpage Analysis
校院名稱 成功大學
系所名稱(中) 機械工程學系專班
系所名稱(英) Department of Mechanical Engineering (on the job class)
學年度 97
學期 2
出版年 98
研究生(中文) 洪銘澤
研究生(英文) Ming-Tse Hung
學號 n1795101
學位類別 碩士
語文別 中文
論文頁數 80頁
口試委員 指導教授-黃聖杰
口試委員-黃登淵
口試委員-李輝煌
中文關鍵字 陰影雲紋法  堆疊式封裝  3D封裝 
英文關鍵字 3D package  Shadow Moiré  POP BGA 
學科別分類
中文摘要 IC封裝元件在完成封裝製程後所殘留的應力或應變會造成IC封裝元件翹曲,而對於經常受熱的IC封裝元件來說,可能會造成殘留熱應力及應變更加嚴重。對於封裝產品平面度及翹曲量的管控一直是IC封裝技術所追求的重點,因為其影響會直接造成表面黏著製程的良率、產品的電性、可靠度等,更嚴重者可能會造成晶片破裂導致喪失產品功能。
在本文中,將以堆疊式電子封裝產品為研究樣品,探討該產品在封裝時所造成之可能翹曲量及如何改善。堆疊式封裝產品厚度約只有一般BGA的一半(0.6~0.85 mm),因為該產品在完成封裝後,尚需以表面黏著技術在該產品上方堆疊BGA(故稱為堆疊式封裝技術)。而在堆疊製程中需要加熱以完成表面黏著製程,此時若產品本身有殘留應力或是翹曲,則更容易造成表面黏著失敗,或是產品功能失效、電性不良、可靠性測試失敗等,故其產品平面度及翹曲量的考驗會遠比一般BGA產品來的嚴苛。在本文中將使用兩種不同CTE之環氧樹脂,並以InPack及ANSYS商業軟體分析及Shadow Moiré量測該產品在升溫過程中所產生之翹曲量,藉以研究環氧樹脂材料對產品翹曲量之影響及找出改善產品翹曲量之方法。
英文摘要 In IC assembly manufacturing, the IC package would be heated for completing final SMT process. It would causes warpage problem if it remaining strain or stress in inside of package. For IC package, the remaining stress and strain would make warpage become worse and damage package due to the CTE of different materials and heating impact. Therefore, to control the warpage situation of IC package is the major subject for assembly technology. The reason is it would impact the process yield, electricity, reliability…etc. The worst case would damage chip and makes IC function failed.
In this research, we will study the warpage of POP BGA package and possible situation in a raise temperature. The thickness of POP BGA is only half of normal PBGA package (0.6~0.85 mm) since normal BGA would mount on it (that’s why we call it POP BGA). Besides normal SMT process on PCB, the POP BGA will have the other SMT process for topside package mounted. In SMT process, it need to heat IC package and the heat will cause SMT failed, poor electricity or reliability failed if it remained stress or strain in in side of package. So the warpage or coplanarity specification would be more tighten then normal BGA.
We will use two kinds of molding compound on two samples which has different CTE and then to measure wapage situation in a raise temperature by Shadow Moiré. And to simulate the POP BGA warpage situation by ANSYS, to study the stress/strain distribution in package for trying to find out a method to predict/control warpage and improving the POP BGA warpage situation in this research.
論文目次 中文摘要.................................................I
英文摘要................................................II
誌謝....................................................IV
目錄.....................................................V
表目錄................................................VIII
圖目錄..................................................IX
第一章 緒論
1.1 前言.................................................1
1.2 研究目的.............................................2
1.3 研究方法.............................................5
1.4 文獻回顧.............................................6
1.5 組織與章節...........................................8
第二章 陰影雲紋法原理及實驗流程
2.1 疊紋干涉技術.........................................9
2.2 陰影雲紋法介紹......................................10
2.3 陰影雲紋法之基本原理................................11
2.4 陰影雲紋法之相位移技術..............................13
2.5 實驗設備及方法......................................15
第三章 數值分析理論
3.1環氧樹脂反應方程式及P-V-T-C狀態方程式................19
3.2 彈性材料分析理論....................................23
3.3 非線性材料分析理論..................................28
第四章 數值模擬分析
4.1 模擬基本假設........................................31
4.2 InPack模擬..........................................31
4.3 ANSYS模擬...........................................33
4.3.1 模型尺寸及材料假設..............................34
4.3.2 材料參數及輸入設定..............................35
4.3.3 模型建立........................................36
4.3.4 分析元素........................................39
4.3.5 模型網格建立....................................40
4.3.6 邊界條件建立....................................41
4.3.7 溫度條件設定....................................42
4.3.8 實驗結果輸出....................................43
第五章 實驗與模擬結果討論
5.1 實驗結果與分析......................................44
5.2 InPack模擬分析結果..................................46
5.3 數值模擬結果分析....................................48
5.4應力分析模擬結果.....................................68
第六章 結論與未來展望
6.1 結論................................................73
6.2 未來展望............................................74
參考文獻................................................75
中文索引................................................77
自述....................................................80
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