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系統識別號 U0026-0812200915255796
論文名稱(中文) IC封裝連續成形之黏模力特性研究
論文名稱(英文) Characterization on the Adhesion Force in Continuous Molding of IC Encapsulation
校院名稱 成功大學
系所名稱(中) 工程科學系碩博士班
系所名稱(英) Department of Engineering Science
學年度 97
學期 2
出版年 98
研究生(中文) 宋政宏
研究生(英文) Cheng-Hung Song
學號 N9696119
學位類別 碩士
語文別 中文
論文頁數 140頁
口試委員 指導教授-李輝煌
口試委員-黃聖杰
口試委員-黃登淵
中文關鍵字 黏著效應  IC封裝  黏模力特性曲線  退冰時間 
英文關鍵字 Characteristic curve  Defrosting period  Adhesion effects  IC packaging 
學科別分類
中文摘要 在IC封裝製程中,封膠材料(Epoxy Molding Compound, EMC)在熟化(Curing)成形過程中會與封裝模具表面產生黏著的現象,稱之為黏著效應(Adhesion effects)。當黏著效應過大時會造成產品的黏模,在脫模時可能會破壞產品,進而導致封膠失敗、生產良率降低與可靠度不佳等結果,因此如何有效的降低黏模力(Adhesion force)是目前產業界及研究單位所重視的主題。本研究利用本實驗室所發展完成的黏模力量測技術與黏模力檢測設備,配合一組與實際封裝生產線相當接近的最佳化製程參數,對五種不同的模具表面鍍層(Coating)進行正向黏模力測試以找出最有效的鍍層。同時也利用此組最佳化製程參數進行500模次的連續實驗,觀察黏模力的變化趨勢,透過線性迴歸分析(Linear regression)將實驗數據擬合出一條黏模力特性曲線,用以判斷最佳清模時機,並與實驗過程做比對,找出黏模力增大的原因,如此才能確實掌握清模時機,縮短清模次數與時間,進而增加產能。最後,針對封膠材料在退冰(Defrosting)回溫期間易受到濕氣影響的特性,以不同的退冰時間作為控制因子去進行正向黏模力測試,了解EMC在回溫期間受到濕度影響的程度與黏模力變化趨勢之間的關聯性,並定義出EMC的最佳使用時間。
英文摘要 In IC packaging, when epoxy molding compound (EMC) is filled in the cavity and cures in the mold, adhesion effects occur in the interface between EMC and mold surface. Excessive adhesion effects would cause product to adhere to the mold and damage product during ejection. Furthermore, there would be failure in the package and decrease the yield rate and reliability. For industry and research institutes, how to reduce the adhesion force effectively is the main issue.
In this study, a semi-automatic adhesion force test instrument that had been developed and fabricated was used to measure normal and shear adhesion force between the mold surface and EMC. This instrument was matched with optimum process conditions that are similar to the process of production line to measure the adhesion force between EMC and five different surface coatings. Then determine which is the most effective surface coating. Optimum process conditions were also used to conduct continuous molding experiment and observe the variation of adhesion force. By linear regression, experiment data could be fitted a characteristic curve to determine the best time for mold cleaning. In order to decrease the frequency and time of mold cleaning and increase productivity, it is important to find out the reason for increasing adhesion force. Because EMC was easily influenced by moisture in defrosting period, different defrosting periods were regarded as control factor to conduct experiments and understand the connection between moisture influence of EMC and the variation of adhesion force. Finally, the best time for using EMC could be defined.
論文目次 摘要 I
Abstract II
致謝 IV
目錄 VI
表目錄 X
圖目錄 XIII
符號說明 XVIII
第一章 緒論 1
1-1 前言 1
1-2 IC封裝製程簡介 3
1-3 封裝模具的黏著問題 5
1-4 研究目的 8
1-5 文獻回顧 10
1-5-1 封膠材料的固化理論 10
1-5-2 封膠材料的黏著性質 10
1-5-3 IC封裝模具的表面處理 11
1-5-4 量測方式的相關文獻 14
1-5-4 黏著強度的量測規範 17
第二章 量測原理與實驗設備說明 22
2-1 黏著強度量測原理 22
2-2 量測試片與封膠材料使用準則 24
2-2-1 量測試片之製作 24
2-2-2 封膠材料使用準則 25
2-3 正向與剪向黏模力複合測試機台簡介 28
2-3-1 模壓機單元 30
2-3-2 模具單元 31
2-3-3 灌膠伺服系統 35
2-3-4 檢測裝置 36
2-4 控制系統 38
2-5 資料擷取系統 39
2-6量測結果 42
第三章 黏模力複合測試機台的檢修與校正 43
3-1 問題分析 43
3-2 機台設備之檢驗 45
3-2-1 機台水平度 45
3-2-2 機台控制程式 46
3-2-3 荷重計校正 46
3-2-4 PID溫度控制器 50
3-3 模具檢驗 51
3-3-1 中板模與下模 51
3-3-2 試片之修改 54
3-4 封膠材料檢驗 56
3-5 灌膠行程參數 58
第四章 正向黏模力量測實驗 61
4-1 不同表面鍍層實驗 61
4-1-1 實驗目的 61
4-1-2 實驗規劃與實驗製程參數 62
4-1-3 實驗結果與討論 64
4-2 長時效連續實驗 71
4-2-1 實驗目的 71
4-2-2 實驗規畫與實驗製程參數 71
4-2-3 實驗結果與討論 73
4-2-4 曲線擬合(Curve fitting) 80
4-2-5 確認實驗 85
4-3 封膠材料的不同退冰回溫時間實驗 92
4-3-1 實驗目的 92
4-3-2 實驗規畫與實驗製程參數 93
4-3-3 實驗結果與討論 95
4-3-4 確認實驗 111
第五章 結論與未來展望 118
5-1 結論 118
5-2 未來展望 120
參考文獻 121
附錄A 126
附錄B 128
索引 136
自述 140
參考文獻 [1] A. C. Loos and G. S. Springer, “Curing of Epoxy Matrix Composites,” Journal of Composite Materials, Vol. 17, No. 2, pp. 135-169, 1983.
[2] G. S. Springer, “Resin Flow During the Cure of Fiber Reinforced Composites,” Journal of Composite Materials, Vol. 16, No. 5, pp. 400-410, 1982.
[3] U. F. González, S. F. Shen, and Claude Cohen, “Rheological Characterization of Fast-Reacting Thermosets Through Spiral Flow Experiments,” Polymer Engineering and Science, Vol. 32, No. 3, pp. 172-181, 1992.
[4] R. L. Frutiger, “The Effect of Flow on Cavity Surface Temperatures in Thermoset and Thermoplastic Injection Molding,” Polymer Engineering and Science, Vol.26, No. 3, pp. 243-254, 1986.
[5] C. C. Lee and C. L. Tucker III, “Flow and Heat Transfer in Compression Mold Filling,” Journal of Non-Newtonian Fluid Mechanics, Vol. 24, No. 3, pp. 245-264, 1987.
[6] D. R. Edwards, K. G. Heinen, S. K. Groothuis, and J. E. Martinez, “ Shear Stress Evaluation of Plastic Packages,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 12, No. 4, pp. 618-627, 1987.
[7] S. Kim, “The Role of Plastic Package Adhesion in Performance,” IEEE Transaction on Components, Hybrids, and Manufacturing Technology, Vol. 14, No. 4, pp. 809-295, 1991.
[8] M. Ko, M. Kim, D. Shin, Y. Park, M. Moon, and I. Lim, “Investigation on the Effect of Molding Compounds on Package Delamination,” Electronic Components and Technology Conference, pp. 1242-1247, San Jose, California, 1997.
[9] N. Tanaka, M. Kitano, T. Kumazawa, and A. Nishimura, “Evaluating IC-Package Interface Delamination by Considering Moisture-Induced Molding-Compound Swelling,” IEEE Transaction on Components and Packaging Technology, Vol. 22, No. 3, pp. 426-432, 1999.
[10] T. Scherban, B. Sun, J. Blaine, C. Block, B. Jin, and E. Andideh, “Interfacial Adhesion of Copper-Low k Interconnects,” IEEE Interconnect Technology Conference, pp. 257–259, Burlingame, California, 2001.
[11] R. Balkova, S. Holcnerova, and V. Cech, “Testing of Adhesion for Bonding of Polymer Composites,” International Journal of Adhesion and Adhesives, Vol. 22, No. 4, pp. 291-295, 2002.
[12] T. L. Gordon and M. E. Fakley, “The Influence of Elastic Modulus on Adhesion to Thermoplastics and Thermoset Materials,” International Journal of Adhesion and Adhesives, Vol. 23, No. 2, pp. 95-100, 2003.
[13] S. Murray, C. Hillman, and M. Pecht, “Environmental Aging and Deadhesion of Siloxane-Polyimide-Epoxy Adhesive,” IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 3, pp. 524-531, 2003.
[14] K. Uehara and M. Sakurai, “Bonding Strength of Adhesives and Surface Roughness of Joined Parts,” Journal of Materials Processing Technology, Vol. 127, No. 2, pp. 178-181, 2002.
[15] S. Zhang, X. Zeng, Z. Tang, and M. Jen Tan, “Exploring the Antisticking Properties of Solid Lubricant Thin Films in Transfer Molding,” International Journal of Modern Physics B, Vol. 16, Nos. 6&7, pp. 1080-1085, 2002.
[16] S. M. Chiu, S. J. Hwang, C. W. Chu, and D. Gan, “The Influence of Cr-based Coating on the Adhesion Force Between Epoxy Molding Compounds and IC Encapsulation Mold,” Thin Solid Films, Vol. 515, No. 1, pp. 285-292, 2006.
[17] P. Navabpour, D. G. Teer, D. J. Hitt, and M. Gilbert, “Evaluation of Non-stick Properties of Magnetron-sputtered Coatings for Moulds Used for the Processing of Polymers,” Surface and Coatings Technology, Vol. 201, No. 6, pp. 3802-3809, 2006.
[18] Y. Y. Hsieh, H. T. Hsu, M. T. Lin, Y. S. Lai, and S. H. Chen, “A Study of Self-assembled Monolayer Coating for Non-stick Encapsulation Mold,” International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, pp. 181-183, 2007.
[19] 張祥傑,微材料測試系統之設計與製作,碩士論文,國立成功大學機械工程研究所,1999年。
[20] 王俊祥,電子封裝黏模效應之量測技術開發與研究,碩士論文,國立成功大學機械工程研究所,2000年。
[21] 莊俊華,IC構裝黏模測試機之設計與製造,碩士論文,國立成功大學工程科學研究所,2001年。
[22] 朱言主,IC封裝模具黏著效應之研究,碩士論文,國立成功大學工程科學研究所,2002年。
[23] M. Yoshii, Y. Mizukami, and H. Shoji, “Evaluation Technologies on Moldability of Epoxy Molding Compounds for Encapsulation of Semiconductors,” Hitachi Chemical Technical Report, No. 40, pp. 13-20, 2003.
[24] S. J. Chang and S. J. Hwang, “Design and Fabrication of an IC Encapsulation Mold Adhesion Force Tester,” IEEE Transaction on Electronics Packaging Manufacturing, Vol. 26, No. 4, pp. 281-285, 2003.
[25] 林俊宏,EMC與金屬介面剪向黏著力試驗機台之研發,碩士論文,國立成功大學工程科學研究所,2003年。
[26] 黃勁華,EMC與金屬介面剪向黏著力試驗機台之設計與改良,碩士論文,國立成功大學工程科學研究所,2004年。
[27] 張祥傑,IC封裝年模力之量測與分析,博士論文,國立成功大學機械工程研究所,2004年。
[28] 李文宏,IC封裝材料對模具正向及剪向黏著力量之研究,碩士論文,國立成功大學工程科學研究所,2005年。
[29] 陳暉長,電子封裝模具以黏著力作為設計參數之可行性研究,碩士論文,國立成功大學工程科學研究所,2006年。
[30] 楊昌明,表面清洗對電子封裝材料和模具間黏著力的影響,碩士論文,國立成功大學工程科學研究所,2007年。
[31] 黃昭霖,剪向與正向黏著力測試機模具之設計與研究,碩士論文,國立成功大學工程科學研究所,2008年。
[32] “Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds,” STD. SEMI G69-0996, 1996.
[33] “Standard Test Method for Apparent Shear Strength of Single-Lap-Joint Adhesively Bonded Metal Specimens by Tension Loading,” STD. ASTM D1002-94.
[34] “Standard Test Method for Cleavage Strength of Metal-to-Metal Adhesive Bonds,” STD. ASTM D1062-96.
[35] “Standard Test Method for Tensile Properties of Adhesive Bonds,” STD. ASTM D897-95a.
[36] “Standard Test Method for Strength Properties of Metal-to-Metal Adhesives by Compression Loading (Disk Shear),” STD. ASTM D2182-72.
[37] “Standard Recommended Practice for Determining the Strength of Adhesively Bonded Plastic Lap-Shear Sandwich Joint in Shear by Tension Loading,” STD. ASTM D3164-73.
[38] B. A. Chapman, H. D. DeFord, G. P. Wirtz, and S. D. Brown, in: Technology of Glass, Ceramic, or Glass-Ceramic to Metal Sealing, W. E. Moddeman, C. W. Merten, and D. P. Kramer (Eds.), MD-Vol. 4, pp. 77-87, American Society of Mechanical Engineers, New York, Copyright 1987.
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