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系統識別號 U0026-0812200914234349
論文名稱(中文) 應用陰影疊紋法量測電子元件的共面性與翹曲量
論文名稱(英文) Measurement of Coplanarity and Warpage of Electronic Components Using Shadow Moire Method
校院名稱 成功大學
系所名稱(中) 機械工程學系碩博士班
系所名稱(英) Department of Mechanical Engineering
學年度 96
學期 2
出版年 97
研究生(中文) 陳璟照
研究生(英文) Ching-Chao Chen
學號 n1695133
學位類別 碩士
語文別 中文
論文頁數 84頁
口試委員 口試委員-潘文峰
口試委員-林世聰
口試委員-羅鵬飛
指導教授-陳元方
口試委員-吳美玲
中文關鍵字 共面性  電路板  陰影疊紋法  翹曲量  晶片 
英文關鍵字 PCB  Shadow Moire  Warpage  Chip  Coplanarity 
學科別分類
中文摘要 本文主要目的是發展出一套能快速搜尋試件共面性的方法,並搭配陰影疊紋法系統,應用於檢測電子元件的共面性與翹曲量,有效的減少搜尋時間。
首先敘述電子元件所定義的共面性與翹曲量原理,並改變原搜尋方式,以較少的時間搜尋共面性;接著介紹陰影疊紋法原始立論基礎,並加入相位移法、相位展開法...等,用以建立此光學量測系統;在系統精確度量測方面,使用低膨脹係數的玻璃校正片BK7,先以高精度表面粗度儀ET3000量測校正片的階高,用來驗證系統在常溫時的精確度;最後以模擬的六種不同型式的形貌,驗證其正確性。
英文摘要 In this paper, the major purpose is to develop a method to determine the coplanarity quickly and to measure the coplanarity and warpage of electronic components using shadow moiré method. The time of calculating the coplanarity can be decreased effectively.
In the beginning, we describe the definition of coplanarity and warpage in electronic industry, and improve the original method to search coplananrity in a shorter period of time. Then, we introduce the original theory of Shadow Moire, and establish optical measuring system by using Shadow Moire method, phase shifting method, phase unwrapping method…etc. About the accuracy of our system, we measure the correction glass with low coefficient of expansion, BK7. First, we measure of the correction sample using surface roughness measuring instrument ET3000 to examine the accuracy of our system at normal temperature, and simulate six different types of profile to examine the correctness.
論文目次 摘要 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
A b s t r a c t . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I I
致謝 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I I I
圖目錄. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V I I
表目錄. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . X I I I
符號說明. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . X V
第一章 緒論. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 研究背景.............................................. 1
1.2 研究目的............................................. 2
1.3 文獻回顧............................................. 3
1.4 本文架構............................................. 5
第二章 共面性量測原理. . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 JEDEC Standard共面性原理............................. 6
2.1.1 LMS法........................................... 7
2.1.2 JEDEC SP法...................................... 8
2.2 快速搜尋法原理....................................... 11
2.2.1 初步拉平....................................... 12
2.2.2 多組底座平面的處理............................. 14
2.2.3 組合法......................................... 16
2.2.4 側翻法......................................... 17
2.2.5 組翻法......................................... 19
2.3 影像3D旋轉原理...................................... 21
2.4 共面性模擬與測試.................................... 23
2.4.1 模擬試件與拉平結果............................. 23
2.4.2 共面性量測模擬試件結果......................... 32
第三章 自動化陰影疊紋系統原理. . . . . . . . . . . . . . . . . 3 4
3.1 陰影疊紋法之原理簡介[21]............................. 34
3.2 相位移法 [22] ....................................... 36
3.3 Macy相位展開法基本概念[22] ......................... 38
第四章 實驗裝置與方法. . . . . . . . . . . . . . . . . . . . . . . . . 3 9
4.1 實驗系統介紹........................................ 39
4.2 溫控系統之測試...................................... 40
4.3 步進馬達校正........................................ 42
4.4 使用校正片對試件平台與光柵之平行校正................. 45
第五章 系統精確度測試. . . . . . . . . . . . . . . . . . . . . . . . . 4 7
5.1 精確度測試之試件.................................... 47
5.2 實驗步驟............................................ 47
5.3 高精度表面粗度儀ET-3000 規格介紹..................... 48
5.4 系統的精確度測試.................................... 50
第六章 實驗結果與討論. . . . . . . . . . . . . . . . . . . . . . . . . 5 3
6.1 電路板升降溫共面性測試.............................. 53
6.1.1 電路板共面性量測結果........................... 53
6.1.2 電路板各種共面性拉平結果與討論................. 66
6.2 IC晶片模擬回火升降溫實驗............................ 71
6.2.1 模擬晶片回火升降溫實驗結果..................... 72
6.2.2 晶片各種共面性拉平結果與討論................... 77
第七章 結論與建議. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 9
7.1 結論................................................ 79
7.2 建議................................................ 80
參考文獻. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1
自述 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4
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