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系統識別號 U0026-0812200910462589
論文名稱(中文) 以銅離子為化學鍍鎳磷鍍液之穩定劑時其析鍍行為之探討
論文名稱(英文) Effect of Cu2+ as a Stabilizer for Electroless Ni-P Deposition
校院名稱 成功大學
系所名稱(中) 化學工程學系碩博士班
系所名稱(英) Department of Chemical Engineering
學年度 92
學期 2
出版年 93
研究生(中文) 陳俊翰
研究生(英文) Chun-Han Chen
電子信箱 adolph0926@yahoo.com.tw
學號 n3691134
學位類別 碩士
語文別 中文
論文頁數 127頁
口試委員 口試委員-李澤民
指導教授-陳炳宏
口試委員-何國川
口試委員-楊毓民
口試委員-李玉郎
中文關鍵字 無電鍍  鎳磷合金    穩定劑  電子穿隧  無電解電鍍  化學鍍 
英文關鍵字 copper  nickel-phosphorus  electroless plating  electron-tunneling theory  stabilizer 
學科別分類
中文摘要 摘要

  化學鍍是現今一種很常採用的金屬沈積方式,而其中又以化學鍍鎳磷合金最為重要──因為該鍍層擁有優秀的抗腐蝕性及硬度,因此鎳磷合金在工業上被廣泛地使用。而化學鍍鍍液中需要添加穩定劑,一般的化學鍍鎳磷鍍液採用的穩定劑為鉛離子,而本實驗採用銅離子作為穩定劑,因為有著鉛離子無法取代的效果:臨界濃度高、加快析鍍速率、改善鍍層表面形態、形成鎳銅磷合金而比鎳磷合金有著更優異的性能、保護環境等。
  而在不同的銅離子濃度下,我們試著對穩定劑如何影響其析鍍行為作一個探討──包括為何加入銅離子後形成的鎳磷合金各方面都比原始情況較佳,並試著以電子穿隧理論來解釋其行為,同時以該理論來預測穩定劑的臨界濃度。


英文摘要 Abstract

  Effect of copper ion (Cu2+) as a stabilizer in plating bath on characteristics of the resulted nickel-phosphorus (Ni-P) alloys was investigated in comparison with that by using the conventional Pb2+ stabilizer. XRD, SEM equipped with EDX were employed to characterize the as-deposited alloy. In general, the deposition rate and morphology was significantly improved with addition of Cu2+. However, the resulted alloy was shown as a mixture of amorphous Ni-P alloy and crystalline copper, in contrast to the amorphous Ni-Cu-P alloys claimed by Armyanov et al. (Electrochem. and Solid-State Lett., 2(7), 323 (1999)). Indeed, the increased deposition rate with Cu2+ present mainly arises from the initial preferential deposition of colloidal copper grains on substrate, which greatly enhanced the exposed surface area for the latter deposition of Ni-P alloy. Moreover, the electron-tunneling theory is successfully introduced to explain the deposition process.



論文目次 目錄

摘要 ……………………………………………………………………I
Abstract ………………………………………………………………II
誌謝 …………………………………………………………………III
目錄 …………………………………………………………………IV
表目錄 ………………………………………………………………VI
圖目錄 ………………………………………………………………VII
第一章 前言 …………………………………………………………1
第二章 原理及簡介 …………………………………………………9
 §2-1化學鍍鎳合金的原理及簡介 ……………………………9
 §2-2關於化學鍍銅的簡介及原理 ……………………………17
第三章 實驗 ………………………………………………………30
第四章 結果與討論 ………………………………………………38
 §4-1化學鍍銅 …………………………………………………38
 §4-2化學鍍鎳磷 ………………………………………………42
 §4-3關於氣泡孔的問題 ………………………………………53
 §4-4就電子穿隧理論預測及臨界行為 ………………………55
第五章 討論 ………………………………………………………103
 §5-1添加界面活性劑所造成的效應 ………………………103
 §5-2不同穩定劑所造成的效應 ……………………………104
(1) 就穩定效果而言 ………………………………………104
(2) 就組成而言 ……………………………………………105
(3) 就表面形態而言 ………………………………………105
(4) 就物理性質而言 ………………………………………106
(5) 就反應速率而言 ………………………………………107
(6) 對穩定劑的臨界現象而言 ……………………………108
(7) 穩定劑臨界值預測 ……………………………………109
第六章 結論 ………………………………………………………111
第七章 文獻回顧 …………………………………………………113
附錄 …………………………………………………………………117
 A-1結果比較 …………………………………………………117
 A-2結果比較 …………………………………………………119
 B數值分析 ………………………………………………………121
 C主要誤差來源 …………………………………………………124

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