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系統識別號 U0026-0812200910380284
論文名稱(中文) 表面鍍銅改良碳纖維/環氧樹脂熱傳導性質之研究
論文名稱(英文) The Investigation of The Thermal Conductivity in Cu-Deposited Carbon/Epoxy Composites
校院名稱 成功大學
系所名稱(中) 材料科學及工程學系碩博士班
系所名稱(英) Department of Materials Science and Engineering
學年度 91
學期 2
出版年 92
研究生(中文) 陳韋伶
研究生(英文) Wei-Ling Chen
學號 N5690416
學位類別 碩士
語文別 中文
論文頁數 90頁
口試委員 指導教授-黃肇瑞
口試委員-李丁福
口試委員-李昌崙
口試委員-丁志明
中文關鍵字 碳纖維/環氧樹脂  銅膜  物理氣相沈積  熱傳導  有效熱傳導係數 
英文關鍵字 Effective thermal conductivity  Copper film  Carbon fiber/epoxy composite  Thermal conduction  PVD 
學科別分類
中文摘要 纖維強化高分子複合材料(Fiber-reinforced Polymer Composites)為目前重要的熱管理材料(Thermal management materials)之一,其優點是質輕易加工,但缺點則是由於纖維的存在導致熱傳導的異向性。鑑於此,本研究以物理氣相沈積法(PVD)將銅膜鍍於碳纖維/環氧樹脂複合基材表面,期望藉此改進基材之熱傳導性。

本實驗將銅膜濺鍍於不同碳纖維方向及不同厚度的複合基材上,以雷射閃光(Laser Flash)測量其熱傳導係數,並以理論公式計算出有效熱傳導係數(Keff),作為比較。在偏壓為-90V的濺鍍條件下,銅膜有最佳的附著性質及較低的電阻係數,故以其為最佳濺鍍條件。

對於複合基材而言,碳纖維的方向對基材的熱傳導影響很大。碳纖維軸方向平行於熱傳遞方向之基材(S⊥)有較佳的熱傳導係數,且隨著鍍於表面的銅膜厚度越厚,熱傳導係數越高。若於厚度各為1mm及3mm的此種基材(碳纖維軸方向與熱傳遞方向平行)表面鍍上0.5、3、10、20、40μm的銅膜,則發現隨著銅膜厚度越厚,基材的熱傳導係數皆越高且兩基材整體的熱傳導係數相近,唯獨當膜厚為40μm時,1mm的基材整體之熱傳導係數較高,為5.5W/mk,比基材本身的熱傳導係數提高了54%,且達有效熱傳導係數之60%。因此,於複合材料表面鍍銅膜,對於幫助整體熱傳導值的提昇是有明顯助益的。
英文摘要 Carbon Fiber/epoxy composite is one of the important thermal management materials but its disadvantages are relatively low thermal conductivity. In order to resolve this problem, physical vapor deposition (PVD) process was used to deposit copper films on carbon fiber/epoxy composite in this work.

The substrates have different thickness and fiber direction, and copper film was deposited on them in different film thickness. The thermal conductivity (K) of the substrates and the as-deposited samples is measured by laser flash and compared with the theoretical effective thermal conductivity (Keff).

The experimental result revealed that copper films would have good adhesion with the substrate and lower electrical resistivity by sputtering with bias voltage of -90V, so, it was the best sputtering condition.

The results also showed that the thermal conductivity of the substrate with fiber axis paralleling to heat flow (S⊥) will be as good as 3.6W/mk. With film thickness up to 40μm , it would increase to 4.91 W/mk. When the thickness of S⊥ decrease to 1mm, the K value would become 5.5W/mk which was 60% of the Keff value and increase 54% of the thermal conductivity of S⊥ itself.
論文目次 中文摘要 I
abstract III

總目錄 IV
圖目錄 VI
表目錄 XI

第一章 、緒論 1
1.1 前言 1
1.2 研究重點 5

第二章、 理論基礎 6
2.1 濺鍍理論-電漿的產生 6
2.2 鍍層的成核 9
2.3 熱傳導理論 13
2.3.1 熱傳導 13
2.3.2 熱傳機制 17
2.3.3 熱傳導相關性質 17
2.3.4 熱阻 18
2.3.5 複合材料的熱傳導計算 18
2.3.6 複合材料的有效熱傳導值 19

第三章、 實驗方法與步驟 22
3.1 實驗流程圖 22
3.2 實驗前準備 22
3.2.1 基材置備 22
3.2.2 靶材 26
3.3 基材前處理 28
3.4 實驗設備 28
3.5 濺鍍步驟與條件 30
3.6 銅膜濺鍍條件 30
3.7 鍍層分析及測量 32
3.7.1 濺鍍速率測量 32
3.7.2 附著性測量 32
3.7.3 微結構 32
3.7.4 電性量測 33
3.7.5 X-ray繞射分析 35
3.7.6 熱傳導分析 35
3.7.7 有效熱傳導值之計算 38

第四章、 結果與討論 42
4.1 反應濺鍍速率-基板偏壓的影響 42
4.2 附著性測試 44
4.3 微結構分析 52
4.3.1 X-ray繞射分析 52
4.3.2 微結構 56

4.4 電阻係數 62
4.5 熱傳導係數 64
4.5.1 熱傳導實驗 64
4.5.2有效熱傳導值(Keff) 69
第五章、 結論 83
未來研究方向 84
參考文獻 86
誌謝 90
作者簡介 91
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