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系統識別號 U0026-0608201914075700
論文名稱(中文) 通電對銅鋅合金電性及機械性質與微結構影響之研究
論文名稱(英文) Effects of current stressing on microstructure and properties of Cu36Zn alloy
校院名稱 成功大學
系所名稱(中) 材料科學及工程學系
系所名稱(英) Department of Materials Science and Engineering
學年度 107
學期 2
出版年 108
研究生(中文) 周韋民
研究生(英文) Wei-Min Chou
電子信箱 normanchou0718@gmail.com
學號 N56064054
學位類別 碩士
語文別 中文
論文頁數 104頁
口試委員 指導教授-林光隆
口試委員-陳貞夙
口試委員-宋振銘
中文關鍵字 銅鋅合金  電遷移  活化能  晶界效應  應變場效應 
英文關鍵字 Cu36Zn alloy  Electromigration  Recrystallization  Grain boundary effect  Strain field effect 
學科別分類
中文摘要 本研究目的為藉由觀察微結構及機械性質探討銅鋅合金通電後造成性質變化的機制，將銅鋅合金薄帶施加10000-16000 A/cm2之電流密度通電2h-5cycles後，利用液態氮急速冷卻試片以觀察通電處理後之微結構。實驗結果顯示隨電流密度的增加，試片之片電阻及微硬度增加比例持續上升，並藉由阿瑞尼斯方程式計算微硬度變化的活化能，顯示活化能可分為低電流密度(10000-13000 A/cm2)之23.9 kJ/mol以及高電流密度(13000-16000 A/cm2)之3.6 kJ/mol。電子背向散射繞射分析(EBSD)在低電流密度區段的試片中觀察到細小晶粒佔比增加、雙晶比例增加等再結晶行為所伴隨之現象，並透過HRTEM在通電試片中觀察到差排的生成。推測電子風力使原子移動而產生差排，新生成的差排作為成核點，伴隨電流生成的焦耳熱效應促進材料發生非完整再結晶行為，因此晶界效應(Grain boundary effet)在本研究中會影響性質表現，但由於平均晶粒尺寸變化並不明顯，仍以應變場效應(Strain field effect)作為低電流密度區段性質變化之主要機制；透過HRTEM在高電流密度的試片中觀察到差排密度急遽上升至1017 m-2以上，推測高電流密度引起之電子風力嚴重破壞晶格結構，以應變場效應作為高電流密度區段性質變化之主要機制。
英文摘要 This study discussed the mechanism of properties change on Cu36Zn alloy after current stressing through the investigation of microstructure and mechanical properties. The strip specimens were subjected to 10000~16000 A/cm2 D.C. for 2h-5cycles and then were rapidly quenched with liquid nitrogen after current stressing to freeze the microstructure for investigation. The results show that the extent of variation of sheet resistance and micro-hardness kept increasing with the increase of current density. The activation energies of micro-hardness change, calculated via Arrhenius equation, were 23.9kJ/mol for low current density (10000~13000 A/cm2) and 3.6kJ/mol for high current density (13000~16000 A/cm2). EBSD analysis indicated that the recrystallization was accompanied by an increase of small grain fraction and twin fraction when the specimen was stressed under low current density. The uncompleted recrystallization behavior is likely ascribed to generation of dislocation induced by electron wind force. The newly formed dislocations act as the nucleation sites for recrystallization. The current-induced Joule heat facilitates the recrystallization behavior. Grain boundary effect will affect the properties, but the change of grain size is not obvious. So strain field effect is still the main mechanism of properties change under low current density. HRTEM analysis indicated that more dislocations were produced in the specimen at high current density, the dislocation density increased abruptly up to 1017 m-2. The properties change under hugh current density is ascribed to strain field effect.
論文目次 中文摘要 I
Extend Abstract II
致謝 XIV
總目錄 XV
圖目錄 XVIII
表目錄 XXIV
第壹章 簡介 1
1-1電遷移 1
1-1-1電遷移理論 1
1-1-2焦耳熱效應 6
1-1-3電遷移對材料晶格之影響 8
1-2純銅與銅合金通電之研究 14
1-2-1電流對微結構之影響 14
1-2-2電流對機械性質之影響 20
1-3電流與再結晶行為 24
1-3-1 退火理論 24
1-3-2 再結晶分類 29
1-3-3 電流與再結晶 33
1-4研究目的 41
第貳章 實驗方法與步驟 42
2-1實驗構想 42
2-2 Cu36Zn合金試片 42
2-3 通電實驗 44
2-4 電性分析 44
2-5 微硬度分析 45
2-6 微結構觀察 45
2-6-1 電子背向散射繞射分析 45
2-6-2 高解析場發射掃描穿透式電子顯微鏡分析 46
第參章 實驗結果與討論 50
3-1 通電前之材料觀察 50
3-1-1 晶粒取向與晶粒尺寸 50
3-1-2 晶格排列與差排 56
3-2 通電對電性與機械性質之影響 59
3-2-1 電流對片電阻之影響 59
3-2-2 電流對微硬度之影響 61
3-3 通電前後晶粒取向與晶粒尺寸變化 64
3-3-1 晶粒取向之變化 66
3-3-2 晶粒尺寸之變化 74
3-4 通電前後晶格排列與差排密度變化 80
3-5 活化能與性質變化機制 89
3-5-1 計算活化能 89
3-5-2 性質變化之機制探討 93
第肆章 結論 97
參考文獻 98
附錄 102
附錄一 晶界效應與應變場效應貢獻比例之計算 102
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