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系統識別號 U0026-0308201515364700
論文名稱(中文) 以乳化超臨界二氧化碳流體進行高深寬比奈米孔洞填充之研究
論文名稱(英文) High aspect ratio nano-hole filling employing emulsified supercritical CO2 electrolytes
校院名稱 成功大學
系所名稱(中) 材料科學及工程學系
系所名稱(英) Department of Materials Science and Engineering
學年度 103
學期 2
出版年 104
研究生(中文) 楊竣傑
研究生(英文) Jun-Jie Yang
學號 N56021250
學位類別 碩士
語文別 中文
論文頁數 105頁
口試委員 指導教授-蔡文達
口試委員-劉全璞
口試委員-楊聰仁
口試委員-林昭任
中文關鍵字 超臨界二氧化碳  電沉積  高深寬比  疏水性 
英文關鍵字 Supercritical carbon dioxide  Electrodeposition  High aspect ratio  Hydrophilic  Hydrophobic 
學科別分類
中文摘要 本研究以乳化超臨界二氧化碳電鍍法,於高深寬比之陽極氧化鋁奈米孔洞中沉積銅金屬,在不添加促進劑及抑制劑的鍍液中,進行超填充的可行性。研究中所使用的奈米孔洞為陽極氧化鋁(Anodic Aluminum Oxide;AAO)模板,利用純鋁在特定電解液下,進行定電位的氧化,可生成高規則孔洞陣列結構,孔道筆直均勻,且依據施予的電壓不同、時間不同,可生成不同孔徑、不同深度之高深寬比孔洞,之後再移除純鋁基材和阻礙層,使其形成穿孔。並藉由C14H19F13O3Si來改變試片之表面能,使其形成疏水性的表面。本研究分別就AAO模板與表面改質(利用C14H19F13O3Si進行表面改質)之AAO模板進行填充,其結果顯示,在填充AAO模板時,傳統常壓與乳化超臨界二氧化碳製程皆可使電解液進入奈米孔洞,且當孔徑大小僅38 nm時,電解液仍可進入奈米孔道當中,但當孔洞深度增長時,乳化超臨界二氧化碳製程填滿速率則比較快速:而在表面改質之AAO模板,傳統常壓製程則無法使電解液進入奈米孔洞當中,若將傳統鍍浴與超臨界二氧化碳乳化後,降低鍍浴之表面張力,則可使液體進去孔洞當中並完全填滿,進而利用電鍍法使銅金屬能完整的由下向上沉積。
英文摘要 In this study, Cu coatings electrodeposited into high-aspect-ratio anodic aluminum oxide substrates (AAO substrate) via emulsified supercritical carbon dioxide (sc-CO¬2) bath without accelerator and inhibitor addition to evaluate the possibility of super-filling. AAO is a self-organized and ordering porous nano-structure. It has diameters of 5-250 nm and high aspect ratio depending on the appropriate anodization conditions. After anodizing, the aluminum substrate and barrier layer will be removed and become the nano through hole. Change the surface energy with C14H19F13O3Si to form a hydrophobic surface. There are two types of AAO mold in this study including hydrophilic AAO and hydrophobic AAO (surface modification with C14H19F13O3Si). The experimental results showed that Cu can be electrodeposit into nano holes of the hydrophilic AAO in conventional bath and emulsified sc-CO2 bath. Electrolyte can enter nano holes which is only 38 nm but the electrodeposition rate in emulsified sc-CO2 bath is faster than in conventional bath when the length of nano holes are more larger. However in hydrophobic AAO, the Cu metal couldn’t be deposited in conventional bath. In contrary, the Cu metal was successfully deposited into the nano hole of hydrophobic AAO, due to its low surface tension.
論文目次 摘要 I
Abstract II
誌謝 VII
總目錄 IX
表目錄 XII
圖目錄 XIII
第一章 前言 1
第二章 文獻回顧 3
2-1 表面處理技術 3
2-2 超臨界流體概論 4
2-2-1超臨界二氧化碳流體之性質及應用 4
2-2-2 微乳化機制 5
2-2-3 界面活性劑所扮演的角色 6
2-3 超臨界二氧化碳流體之電鍍技術 8
2-4 高深寬比電鍍技術之應用 10
2-4-1 超填充(Super-filling)狀態 11
2-4-2 添加劑的功用 12
2-4-3 超音波震盪電鍍填孔 13
2-4-4超臨界填孔技術 14
2-4-5 高深寬比電鍍技術之應用 17
2-5 陽極氧化鋁(Anodic Aluminum Oxide;AAO) 18
2-5-1 AAO製備方法與結構 19
2-5-2 AAO之成長機制 20
2-6 接觸角性質 22
2-7 C14H19F13O3Si性質 23
第三章 實驗步驟 51
3-1 試片製備 51
3-1-1 AAO模板製作 51
3-1-2 表面改質之AAO模板製作 51
3-2超臨界流體電鍍系統 52
3-2-1 電鍍設備 52
3-2-2 電解液組成 53
3-2-3 電鍍製程 53
3-2-4 實驗架構 53
3-3 試片分析 54
3-3-1 AAO模板形貌分析 54
3-3-2 AAO模板接觸角分析 54
3-3-3 銅鍍層之橫截面觀察 54
第四章 結果與討論 62
4-1 AAO基材分析 62
4-1-1 孔洞大小與長度分析 62
4-1-2 AAO接觸角分析 63
4-2 AAO模板填充行為 63
4-2-1填充AAO模板 64
4-2-2孔徑大小的影響 65
4-2-3孔洞長度的影響 67
4-2-4電流密度之影響 68
4-3 表面改質之AAO模板填充行為 69
4-4 試片接觸角差異討論 71
第五章 結論 99
第六章 未來研究方向 100
參考資料 101
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